Flip chip bonding technique using transferred microsolder bumps

Tsunetsugu, H.; Hayashi, Tsuyoshi; Hosoya, Masahiro; Katsura, K.; Hirano, Makoto; Imai, Yasuhiko

doi:10.1109/3476.650965

Cited by 9 publications

(6 citation statements)

References 17 publications

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“…Therefore, even if the VCSEL is bump mounted on the OE film, positional deviations occur. In addition, the shear strength is less than 1/10 of the value obtained in the bump mounting of Si-Si [9] (~0.3 gf/bump). Hence, mechanical strength cannot be assured.…”

Section: Studies Of Mechanically Strong Oe-cof Packagingmentioning

confidence: 84%

“…The flip-chip packaging of the VCSEL and the OE film was accomplished in the following way. Au-Sn solder bumps with a 40-µm diameter formed on the VCSELs by using the transferred bump technology [9,10] were temporarily fixed by heating with pressure at a temperature below the melting point on bump pads (Ti/Pt/Au: total film thickness 0.3 µm) with a diameter of 36 µm formed on the OE film by evaporation and lift-off. Then, reflow processing was applied at a temperature above the melting point.…”

Section: Structure For Discussion and Subjects Of Investigationmentioning

confidence: 99%

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Optoelectronic chip on film (OE‐COF) packaging technology

Takahara

Ishibashi

Ishizawa

et al. 2002

Electron Comm Jpn Pt II

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SUMMARYAs a next-generation film carrier packaging technique intended for applications to high-speed large-capacity optical modules, OE-COF (Optoelectronic Chip on Film) packaging is proposed, in which LSIs and optical devices are installed on an optoelectronic compound film (OE film) by means of solder bumps. Its realizability is discussed. A 10-channel VCSEL of the 0.85-µm band with a 250-µm pitch is flip-chip mounted on an OE film by using thirty-six 80% Au-Sn solder bumps with a diameter of 40 µm. In regard to the basic configuration that couples an optical waveguide via a 45° mirror formed on the OE film, a mechanically strong flip-chip mounting of the VCSEL on an OE film and a low-loss optical coupling structure of the VCSEL and the OE film are discussed. As a result, a lowthermal-expansion OE film (11 × 10 -6

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Section: Studies Of Mechanically Strong Oe-cof Packagingmentioning

confidence: 84%

Section: Structure For Discussion and Subjects Of Investigationmentioning

confidence: 99%

Optoelectronic chip on film (OE‐COF) packaging technology

Takahara

Ishibashi

Ishizawa

et al. 2002

Electron Comm Jpn Pt II

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“…To prevent such damage and to achieve high-density interconnections, we have developed a defect-free flip-chip-bonding technique that uses transferred microsolder bumps of 100% In or 60% Sn-Pb [6]. This technique has several features and the fabrication process has several benefits as mentioned below.…”

Section: Introductionmentioning

confidence: 99%

Advanced flip chip bonding techniques using transferred microsolder bumps

Koshoubu

Ishizawa

Tsunetsugu

et al. 2000

IEEE Trans. Comp. Packag. Technol.

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For future high-speed and high-density opto-electronic multi-chip module (OE-MCM) packaging, we developed two advanced transferred microsolder bump bonding techniques. One uses 80% Au-Sn, which allows module packaging using processes at various temperatures because it has a higher melting temperature than 100% In and 60% Sn-Pb solders. The other uses multiple transfers of bumps to achieve accurate three-dimensional flip-chip bonding with precise vertical and horizontal alignments within an error of 0 5 m. These techniques will thus be very useful in developing high-speed and high-density OE-MCM's for multi-functional board-level interconnection in future optical communication systems.Index Terms-Flip chip, microelectric packaging, OE-MCM, optical alignment, self alignment, solder bump.

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“…Meanwhile, micromachining technologies such as laser dicing make possible the processing of small dielectric structures. Especially, high resolution of alignment between chips and wafers has been made possible through the use of micromachining technologies such as solder ball bumping and flip chip bonding [9].…”

Section: Introductionmentioning

confidence: 99%