Flip chip ball grid array component testing under board flexure

Hsieh, G.; McAllister, Alan

doi:10.1109/ectc.2005.1441385

Cited by 21 publications

(14 citation statements)

References 4 publications

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“…Orienting the package at 45 degrees to the bending direction increases the stress in the corner solder joints and provides a more conservative estimate of flexural limit. Hsieh & McAllister [6] have published an excellent comparative study of the various flexural options and identified the spherical bend geometry as the method that generates the highest tensile stress in the corner solder joint for a given displacement from the unloaded position. Celestica has selected the spherical bend test setup for this work for three primary reasons out lined in previous work by the authors [7,8,9].…”

Section: Test Methodsmentioning

confidence: 99%

Safe working process strain limits for large area array packages: Observations from spherical bend testing

McMahon¹,

Gray²,

Standing³

2012

2012 IEEE 62nd Electronic Components and Technology Conference

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The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes, designed to reduce Z-axis expansion and improve the materials resistance to thermal excursions through primary attach and rework operations have also produced harder resin systems with reduced fracture toughness. This reduction in toughness has increased the incidence of the "Pad crater / Pad Lift" defects which are now reported as the dominant failure mode for Pb-free compliant materials. Observations from multiple streams of field returned product are now available to confirm this change in failure mode.This work discusses multiple phases of bend to failure testing and the implications for mechanical reliability of Pbfree product. The various phases were intended to investigate relationships commonly accepted for SnPb processes when they are applied to Pb-free compatible materials. The relationships between safe working strain, strain rate and board thickness are examined in the first phase. The second phase directly compares commonly used standard loss laminate materials and the impact of micro clay fillers in these resin systems which has been identified as a significant factor by other investigators. The effect of extended thermal excursions for an extensively used standard loss laminate material is also investigated.Assembly process and test methods are discussed in addition to selected results, failure analysis and distribution parameters. The effectiveness of a simplified predictive model that includes board and package parameters will also be discussed.

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Section: Test Methodsmentioning

confidence: 99%

Safe working process strain limits for large area array packages: Observations from spherical bend testing

McMahon¹,

Gray²,

Standing³

2012

2012 IEEE 62nd Electronic Components and Technology Conference

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“…The mechanical test parameters include support span, load span and crosshead travel distance. According to the JEDEC test standard, the crosshead travel distance of the test machine is proportional to the global strain in PCB, , with the following approximate relationship: (4) where and are the support and load span, respectively, and is the PWB thickness. With a pre-set strain rate, the crosshead speed can be obtained from the time derivative of .…”

Section: E Four-point Bending Systemmentioning

confidence: 99%

“…Among many test methods, such as drop/shock tests, and vibration etc., the four-point bend test using strain gauges is a common method to provide mechanical integrity information for BGA packages [1]- [3]. Intel Corporation has reported the use of two strain gauges, one attached to the corner of the FC-BGA substrate and the other attached to the back side of the PCB, to study the effects of bend mode [4]. The study demonstrated the possibility of associating the substrate strain state to the progress of landside Manuscript [5].…”

Section: Introductionmentioning

confidence: 99%

Fiber Bragg Grating Sensors for Failure Detection of Flip Chip Ball Grid Array in Four-Point Bend Tests

Hussain

Zhou

et al. 2009

IEEE Sensors J.

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We have successfully demonstrated the application of fiber Bragg grating sensors to detect the solder interconnect debounding between flip chip ball grid array and printed circuit board in four-point bend tests. Four sensors, due to their small size, are surface-mounted on the four-corners of the ball grid array substrate, about 1 mm from the solder balls that allow more sensitive strain measurement under board flexure. The measured strain data are compared with the data from strain gauge, daisy chain resistance, and dye and pry test. The preliminary results show that the fiber sensors are capable of detecting the onset of solder joint fracture, strain relaxation, and extent of the failure.Index Terms-Fiber Bragg grating sensor, four-point bending test, strain detection.

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“…Its geometry and mesh details are illustrated in Figs. 1a, b. CGs are usually modelled by an L-shape pattern [8]. However, the CG appears as a dot on Fig.…”

Section: Introductionmentioning

confidence: 99%

Robustness Evaluation of Adhesively Bonded Ceramic Quad Flat Chips for Space Applications

Fekih

Kouroussis

Fruytier

et al. 2014

Mechanisms and Machine Science

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Ceramic quad flat packs (CQFP) electronic components have long been used in power devices in the space industry. Soldering CQFPs to a printed circuit board (PCB) is not sufficient and thus the use of adhesives for reinforcement is compulsory. In fact, the risk of failure becomes very high during launch missions due to harsh constant and random accelerations. The paper investigates various distributions of two common thermally conductive and one epoxy adhesives. The intention is to compare the effects of these adhesive bonds on the robustness to vibrations of solder joints. Results are generated from a finite element (FE) model consisting of a CQFP component, an adhesive layer and a PCB. Key outputs such as the maximum deflection of the PCB, the stress in the solder joints and the fatigue lifetime of the assembly are discussed. Recourse to FE simulations allows competitiveness in terms of design cost and delivery time.

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Flip chip ball grid array component testing under board flexure

Cited by 21 publications

References 4 publications

Safe working process strain limits for large area array packages: Observations from spherical bend testing

Safe working process strain limits for large area array packages: Observations from spherical bend testing

Fiber Bragg Grating Sensors for Failure Detection of Flip Chip Ball Grid Array in Four-Point Bend Tests

Robustness Evaluation of Adhesively Bonded Ceramic Quad Flat Chips for Space Applications

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