2019 22nd European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC) 2019
DOI: 10.23919/empc44848.2019.8951863
|View full text |Cite
|
Sign up to set email alerts
|

Flip Chip Assembly on Coreless Substrate Challenge with Die Bond Solution

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2020
2020
2023
2023

Publication Types

Select...
1
1

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(1 citation statement)
references
References 3 publications
0
1
0
Order By: Relevance
“…The coreless structure opened the door for increasing the efficiency and power density of AC machine drives with low conduction loss. However, the coreless structure requires bonding methods to keep the stiffness for rotating because there is no core [15]. Therefore, a 3D-printed hybrid AFPMSM has been proposed to increase efficiency and power density to keep high efficiency and power density with the core [16].…”
Section: Introductionmentioning
confidence: 99%
“…The coreless structure opened the door for increasing the efficiency and power density of AC machine drives with low conduction loss. However, the coreless structure requires bonding methods to keep the stiffness for rotating because there is no core [15]. Therefore, a 3D-printed hybrid AFPMSM has been proposed to increase efficiency and power density to keep high efficiency and power density with the core [16].…”
Section: Introductionmentioning
confidence: 99%