Flip chip assembly challenges using high density, thin core carriers

Jadhav, Virendra R.; Moore, S.; Palomaki, C.; Tran, S.

doi:10.1109/ectc.2005.1441284

Proceedings Electronic Components and Technology, 2005. ECTC '05.

DOI: 10.1109/ectc.2005.1441284

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Flip chip assembly challenges using high density, thin core carriers

Virendra R. Jadhav

S. Moore

C. Palomaki

et al.

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Cited by 10 publications

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Thermal performance of a thin high interconnect density organic substrate for flip-chip applications

Calmidi

Proceedings Electronic Components and Technology, 2005. ECTC '05.

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Flip chip assembly challenges using high density, thin core carriers

Cited by 10 publications

References 1 publication

Thermal performance of a thin high interconnect density organic substrate for flip-chip applications

Thermal performance of a thin high interconnect density organic substrate for flip-chip applications

Fine Pitch (150/spl mu/m) Pb-Free Flip-Chip Bumping and Packaging

Thermal Enhancement of Systems using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board

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