Flexible Polyimide Micropump Fabricated Using Hot Embossing

Komatsuzaki, Hiroki; Suzuki, Kenta; Liu, Yingwei; Kosugi, Tatsuya; Ikoma, Ryuta; Youn, Sung-Won; Takahashi, Masaharu; Maeda, Ryutaro; Nishioka, Yasushiro

doi:10.1143/jjap.50.06gm09

Cited by 24 publications

(18 citation statements)

References 35 publications

(55 reference statements)

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“…As PI has good sealing properties, flexible PI diaphragms have been used for micropumps [101,102]. Komatsuzaki et al fabricated an all PI-based flexible micropump employing hot embossing [103]. Furthermore, chemical inertness makes PI a suitable material for the development of organic microreactors, where PDMS cannot be used due to low chemical stability.…”

Section: Poly(imide) (Pi)mentioning

confidence: 99%

Flexible Microfluidics: Fundamentals, Recent Developments, and Applications

et al. 2019

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Miniaturization has been the driving force of scientific and technological advances over recent decades. Recently, flexibility has gained significant interest, particularly in miniaturization approaches for biomedical devices, wearable sensing technologies, and drug delivery. Flexible microfluidics is an emerging area that impacts upon a range of research areas including chemistry, electronics, biology, and medicine. Various materials with flexibility and stretchability have been used in flexible microfluidics. Flexible microchannels allow for strong fluid-structure interactions. Thus, they behave in a different way from rigid microchannels with fluid passing through them. This unique behaviour introduces new characteristics that can be deployed in microfluidic applications and functions such as valving, pumping, mixing, and separation. To date, a specialised review of flexible microfluidics that considers both the fundamentals and applications is missing in the literature. This review aims to provide a comprehensive summary including: (i) Materials used for fabrication of flexible microfluidics, (ii) basics and roles of flexibility on microfluidic functions, (iii) applications of flexible microfluidics in wearable electronics and biology, and (iv) future perspectives of flexible microfluidics. The review provides researchers and engineers with an extensive and updated understanding of the principles and applications of flexible microfluidics.

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Section: Poly(imide) (Pi)mentioning

confidence: 99%

Flexible Microfluidics: Fundamentals, Recent Developments, and Applications

et al. 2019

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“…As a more efficient and cost effective method, nanoimprint lithography has recently been utilized for microscale polyimide patterning [22][23]. However, the thermal nanoimprinting of polyimide remains to be challenging because it requires a high nanoimprinting temperature of over 300 o C, which leads to high thermal residual stress and poor layer-to-layer overlay accuracy.…”

Section: Introductionmentioning

confidence: 99%

Cu/Polyimide Multilayer Interconnections Fabricated by Nanoimprint at Every Lithography Process

Suzuki

Youn

Park

et al. 2014

J. Photopol. Sci. Technol.

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In this study, Cu/polyimide multilayer interconnections (dual-damascene) approach based on a UV-assisted thermal nanoimprint technique at every lithography process was demonstrated aiming at developing a low-cost fabrication process for high-density interconnections in polyimide. The dual-damascene process can be simplified by nanoimprint using a multi-tiered mold, and realize fine interconnections using a soluble polyimide block copolymer with a high formability and low shrinkage during a polyimide patterning process. Three-layered Cu/polyimide structures with a minimum wire-width of 5 µm were fabricated in the polyimide by performing subsequent Cu electroplating and chemical mechanical polishing (CMP). The feasibility of the process was thus verified. The electric resistances values of the fabricated three-layered interconnections measured by a four-terminal method showed linear increase as a function of the number of interconnection vias. Heat resistance test at 260 o C which corresponded to reflow soldering process was also evaluated; less than 1.2%-increasing ratio of electric resistance was obtained in the case of 3-cycle heating.

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“…Therefore, PI is expected to withstand the high temperatures required for the sterilization process. PI-based microstructures have already been shown to be transferable by hot embossing and are therefore suitable for microelectromechanical systems (MEMS) fabrication processes [18][19][20][21][22][23]. However, conventional PI is not transparent and has an opaque tan color, which would make it difficult to observe any cells cultured on PI sheets.…”

Section: Introductionmentioning

confidence: 99%

A Transparent Polyimide Film as a Biological Cell Culture Sheet with Microstructures

Maenosono¹,

Saito²,

Nishioka³

2014

JBNB

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The research on stem cell cultures has attracted much attention due to the recent development of regenerative medicine. Therefore, higher functionalities for devices used for culturing cells are strongly demanded. In this study, we fabricated cell culture sheets using transparent polyimide (PI), parylene (PA), and polyetheretherketone (PEEK) to make polymer materials that had microstructures. We then cultured stromal marrow cells (OP9) on them and investigated the cell alignment within the microstructures. Hot embossing was used to fabricate the microstructures with a width and depth of 5 μm on the polymer substrates. Cultivation of the cells was confirmed on the transparent PI and PA sheets, however, it was not observed on the PEEK sheet. Slight alignment of the cells was also observed along with the microstructures.

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Flexible Polyimide Micropump Fabricated Using Hot Embossing

Cited by 24 publications

References 35 publications

Flexible Microfluidics: Fundamentals, Recent Developments, and Applications

Flexible Microfluidics: Fundamentals, Recent Developments, and Applications

Cu/Polyimide Multilayer Interconnections Fabricated by Nanoimprint at Every Lithography Process

A Transparent Polyimide Film as a Biological Cell Culture Sheet with Microstructures

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