Flexible N-Doped Carbon Nanofiber-Polydimethylsiloxane Composite Containing La_0.85Sr₀.₁₅CoO_3−δ Nanoparticles for Green EMI Shielding

Abstract

High-performance green electromagnetic interference (EMI) shielding materials are in great demand due to the growing need for portable electronic devices and high speed digital communication devices. Developing high-efficiency, lightweight, and flexible EMI shielding materials for practical applications is still a major challenge. Herein, we demonstrate a facile approach for fabricating thin and lightweight N-doped carbon nanofibers (CNFs) containing La 0.85 Sr 0.15 CoO 3−δ (LSCO) nanoparticles (NPs) (LSCO-CNFs) through electrospinning followed by heat treatment. CNFs incorporated with 25 wt % LSCO NPs (LSCO-CNFs-25) exhibited high electrical conductivity (2.1 S cm −1 ) and high EMI shielding effectiveness (EMI SE) of 45 dB with a low thickness (0.08 mm) in Xband, K u -band, and K-band (8.2−26.5 GHz). The material showed an absorption-dominated shielding mechanism due to formation of a 3D electrically conductive network, high interfacial polarization arising from the presence of LSCO NPs in CNFs, and the porous and layer-by-layer structure of CNFs. The flexible polydimethylsiloxane (PDMS) composites of LSCO-CNFs were prepared by hand lay-up methods for enhancing the mechanical properties and hydrophobicity. The LSCO-CNFs-25 PDMS composites exhibited a high EMI SE of 45.6 dB with a thickness of 0.62 mm. The LSCO-CNFs-PDMS composites are ideal for fabricating lightweight, thin, waterproof, flexible, and high-performance EMI shielding materials.

Ti3C2Tx MXene- and Sulfuric Acid-Treated Double-Network Hydrogel with Ultralow Conductive Filler Content for Stretchable Electromagnetic Interference Shielding

“…(e) Schematic illustration of the EMI shielding mechanism of the M 20 S 12 PPH. (f) Normalized EMI SE after stretching and releasing at different strains of M 20 S 12 PPH and other conductors in the literature. − (g) Comparison of EMI SE at 26.5 GHz and conductive filler content of M 20 S 12 PPH and other landmark conductors. ,− …”

“…As shown in Figure g, MSPPH has the largest maximum EMI SE of 99 dB and the lowest conductive filler content of 0.6% among various landmark conductors (Supplementary Table S1). ,− The excellent mechanical and EMI shielding performance achieved at such a low conductive filler content positions MSPPH as a low-cost and promising EMI shielding material for next-generation flexible electronics.…”

Multifunctional Dy2NiMnO6/Reduced Graphene Oxide Nanocomposites and Their Catalytic, Electromagnetic Shielding, and Electrochemical Properties

“…Sharma et al fabricated N–La 0.85 Sr 0.15 CoO 3−δ (LSCO) nanoparticles incorporated carbon nanofiber-polydimethylsiloxane composite through a combination of electrospinning and heat treatment processes. Twenty-five wt % CNFs incorporated LSCO exhibits maximum EMI shielding effectiveness of 45 dB at a thickness of 0.08 mm in a frequency range of 8.2–26.5 GHz due to the synergistic effect of both LSCO and CNFs, high interfacial polarization, and 3D electrically conductive network of LSCO and layer-by-layer and porous structure of CNFs . Recently, carbon-based composite materials have been employed for microwave electromagnetic interference shielding (EMI) applications using 1D materials (CNTs, CNFs, etc.…”

Tellurium Nanoparticles Incorporated into Electrospun Poly(acrylonitrile) Nanofibers, Followed by Carbonization and Their Poly(dimethylsiloxane) Composites for Electromagnetic Interference Shielding

“…However, metal-based shielding materials are being replaced because of their heavy weight, corrosive nature, and reflection-based shielding mechanism, which can cause secondary EMI. Current research focuses on alternate materials such as two-dimensional (2D) nanomaterials like MXenes − and carbon-based materials such as carbon nanofibers (CNFs), , carbon foam, − and graphene , due to their versatile features. Among them, one-dimensional (1D) CNF materials and their polymer composites assume great interest because of their unique advantages .…”