2017
DOI: 10.1039/c7ra09921e
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Flexible grid-mesh electrodes fabricated by electroless copper plating on corona-treated PET substrates and coating with graphene for transparent film heaters

Abstract: Graphene-coated Cu mesh electrodes for transparent flexible film heaters have been successfully fabricated on corona-treated PET substrates via solution processes.

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Cited by 11 publications
(6 citation statements)
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References 31 publications
(22 reference statements)
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“…However, most polymeric packaging materials have low surface energy because they lack hydrophilic groups. Thus, corona treatment to increase the surface energy and adhesion to the barrier coating solution has been applied to PET films for multilayered film formation 23 …”
Section: Introductionmentioning
confidence: 99%
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“…However, most polymeric packaging materials have low surface energy because they lack hydrophilic groups. Thus, corona treatment to increase the surface energy and adhesion to the barrier coating solution has been applied to PET films for multilayered film formation 23 …”
Section: Introductionmentioning
confidence: 99%
“…Thus, corona treatment to increase the surface energy and adhesion to the barrier coating solution has been applied to PET films for multilayered film formation. 23 The current study was designed to develop PET films coated with for 60 and 30 min, respectively. The mean particle size of MMT was measured via dynamic light scattering using a nano-ZS nanosize analyzer (Malvern, Worcestershire, UK).…”
Section: Introductionmentioning
confidence: 99%
“…[2][3][4] This class of electrodes is of interest in a variety of engineering applications, spanning from soft actuators and sensors, to flexible electronics and batteries. [5][6][7] As research and development in the areas of soft robotics [8][9][10] and smart wearable devices [11,12] is surging, manufacturing of flexible electrodes will further grow in importance in the years to come.…”
Section: Introductionmentioning
confidence: 99%
“…However, the circuit lines used in current flexible devices are manufactured primarily by direct metal depositions through evaporation, sputtering, and electroplating. [22][23][24] In addition, the flexible circuit boards require high conductivity and negligible resistance change during repeated bending cycles, and also request patternability with a high degree of freedom in pattern design. [25][26][27][28] Similar many studies utilizing the microcracks of metal films for the uses as piezoresistive strain sensors and large-area stretchable electrodes.…”
Section: Introductionmentioning
confidence: 99%