“…With the rapid development of miniaturization, high density, and high performance of electronic and power devices, there is an urgent need to develop thermal management films with high thermal efficiency and mechanical strength [1][2][3][4][5][6]. Based on the advantages of aramid nanofibres (ANF) in terms of flexibility, electrical insulation, mechanical strength, and high-temperature resistance, its films are widely used in high-performance battery separators [7,8], composite materials [9], flexible electronics [10], and other fields. However, the inherent low thermal efficiency of ANF limits further applications [11,12].…”