Flexible boron nitride composite membranes with high thermal conductivity, low dielectric constant and facile mass production

Yu, Xingxing; Xue, Mingshan; Yin, Zuozhu; Luo, Yidan; Hong, Zhen; Xie, Chan; Yang, Yingbin; Ren, Zeming

doi:10.1016/j.compscitech.2022.109400

Cited by 31 publications

(19 citation statements)

References 47 publications

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“…Among the 0.02–0.2 MHz frequency, the dielectric constant of the composite films was decreased with increasing frequency. At lower frequencies, the dipole functional groups in the PVA polymerization chain can align themselves, resulting in higher dielectric constants . At the frequency of 0.02 MHz, the composite film PVA/SiN70 exhibited the highest dielectric constant of 1.9, while the PVA/SiN10 showed the lowest dielectric constant of only 1.3.…”

Section: Resultsmentioning

confidence: 99%

“…At lower frequencies, the dipole functional groups in the PVA polymerization chain can align themselves, resulting in higher dielectric constants. 43 At the frequency of 0.02 MHz, the composite film PVA/SiN70 exhibited the highest dielectric constant of 1.9, while the PVA/SiN10 showed the lowest dielectric constant of only 1.3. The dielectric constant of the composite film was much lower than the intrinsic dielectric constant of Si 3 N 4 .…”

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confidence: 93%

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Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si₃N₄ Nanowires

Wan

Zhu

et al. 2023

ACS Appl. Mater. Interfaces

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As the rapid development of advanced foldable electronic devices, flexible and insulating composite films with ultra-high in-plane thermal conductivity have received increasing attention as thermal management materials. Silicon nitride nanowires (Si 3 N 4 NWs) have been considered as promising fillers for preparing anisotropic thermally conductive composite films due to their extremely high thermal conductivity, low dielectric properties, and excellent mechanical properties. However, an efficient approach to synthesize Si 3 N 4 NWs in a large scale still need to be explored. In this work, large quantities of Si 3 N 4 NWs were successfully prepared using a modified CRN method, presenting the advantages of high aspect ratio, high purity, and easy collection. On the basis, the super-flexible PVA/Si 3 N 4 NWs composite films were further prepared with the assistance of vacuum filtration method. Due to the highly oriented Si 3 N 4 NWs interconnected to form a complete phonon transport network in the horizontal direction, the composite films exhibited a high in-plane thermal conductivity of 15.4 W•m −1 •K −1 . The enhancement effect of Si 3 N 4 NWs on the composite thermal conductivity was further demonstrated by the actual heat transfer process and finite element simulations. More significantly, the Si 3 N 4 NWs enabled the composite film presenting good thermal stability, high electrical insulation, and excellent mechanical strength, which was beneficial for thermal management applications in modern electronic devices.

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Section: Resultsmentioning

confidence: 99%

mentioning

confidence: 93%

Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si₃N₄ Nanowires

Wan

Zhu

et al. 2023

ACS Appl. Mater. Interfaces

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“…Therefore, BPA/PP based PEN can become the alternative materials for the fields of flexible electronics, packaging, wireless communication and other fields. [67][68][69]…”

Section: Dielectric Properties Of Pen Filmsmentioning

confidence: 99%

Synthesis of phenolphthalein/bisphenol A‐based poly(arylene ether nitrile) copolymers: Preparation and properties of films

Zhang

Liu

2022

J of Applied Polymer Sci

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Poly(arylene ether nitrile) (PEN) is a class of high‐performance engineering plastics of poly(arylene ether) with cyano groups as side groups, which can get improved thermal, mechanical, and electrical properties through simple molecular structure design. In this work, a series of PEN (BPA/PP based PEN) copolymers were synthesized with varying amounts of phenolphthalein and bisphenol A. The influence of the copolymer molecular structure variations on the thermal, mechanical, and dielectric properties of PEN copolymer films was investigated. The results demonstrated that the BPA/PP based PEN copolymer films have great mechanical properties and low dielectric constant, as well as enhanced thermal properties. The highest 5% weight loss temperature of 494.9°C was obtained by PEN‐B7P3, while the highest glass transition temperature of 238.6°C was obtained by PEN‐B3P7. Porous BPA/PP based PEN films prepared by non‐solvent induced phase separation (NIPS) exhibited satisfactory mechanical properties and the highest tensile strength of 9.4 MPa was achieved. Moreover, the introduction of the phenolphthalein structure into the PEN molecular chain can improve the heat resistance of the PEN copolymers without deteriorating the dielectric properties, which gives the copolymers great potential as candidates for applications in flexible electronics and wireless communication.

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“…In addition, as a material that possesses high temperature resistance and high thermal conductivity, boron nitride (BN) has extensive application in the production of multifunctional composite materials. 28,29 The special crystal structure of BN imparts substantial chemical inertness, weak interfacial nucleophilicity, and suboptimal dispersion, which limit the compatibility of BN with other substances. 30,31 Therefore, the resolution of interfacial bonding challenges between the protein and BN and careful selection of the cross-linking agent are crucial factors for preparing a microphase separation structure that facilitates thermal conductivity while simultaneously preventing the adhesive's performance from deteriorating.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Strong and Thermally Conductive, Spider Silk-Inspired, Soybean Protein-Based Adhesive for Thermally Conductive Wood-Based Composites

Zhang,

Long,

Zhu

et al. 2023

ACS Nano

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The development of formaldehyde-free functional wood composite materials through the preparation of strong and multifunctional soybean protein adhesives to replace formaldehyde-based resins is an important research area. However, ensuring the bonding performance of soybean protein adhesive while simultaneously developing thermally conductive adhesive and its corresponding wood composites is challenging. Taking inspiration from the microphase separation structure of spider silk, boron nitride (BN) and soy protein isolate (SPI) were mixed by ball milling to obtain a BN@SPI matrix and combined with the self-synthesized hyperbranched reactive substrates as amorphous region reinforcer and cross-linker triglycidylamine to prepare strong and thermally conductive soybean protein adhesive with cross-linked microphase separation structure. These findings indicate that mechanical ball milling can be employed to strip BN followed by combination with SPI, resulting in a tight bonded interface connection. Subsequently, the adhesive’s dry and wet shear strengths increased by 14.3% and 90.5% to 1.83 and 1.05 MPa, respectively. The resultant adhesive also possesses a good thermal conductivity (0.363 W/mK). Impressively, because hot-pressing helps the resultant adhesive to establish a thermal conduction pathway, the thermal conductivity of the resulting wood-based composite is 10 times higher than that of the SPI adhesive, which shows a thermal conductivity similar to that of ceramic tile and has excellent potential for developing biothermal conductivity materials, geothermal floors, and energy storage materials. Moreover, the adhesive possessed effective flame retardancy (limit oxygen index = 36.5%) and mildew resistance (>50 days). This bionic design represents an efficient technique for developing multifunctional biomass adhesives and composites.

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Flexible boron nitride composite membranes with high thermal conductivity, low dielectric constant and facile mass production

Cited by 31 publications

References 47 publications

Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si₃N₄ Nanowires

Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si₃N₄ Nanowires

Synthesis of phenolphthalein/bisphenol A‐based poly(arylene ether nitrile) copolymers: Preparation and properties of films

Preparation of Strong and Thermally Conductive, Spider Silk-Inspired, Soybean Protein-Based Adhesive for Thermally Conductive Wood-Based Composites

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Flexible boron nitride composite membranes with high thermal conductivity, low dielectric constant and facile mass production

Cited by 31 publications

References 47 publications

Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si3N4 Nanowires

Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si3N4 Nanowires

Synthesis of phenolphthalein/bisphenol A‐based poly(arylene ether nitrile) copolymers: Preparation and properties of films

Preparation of Strong and Thermally Conductive, Spider Silk-Inspired, Soybean Protein-Based Adhesive for Thermally Conductive Wood-Based Composites

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Product

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Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si₃N₄ Nanowires

Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si₃N₄ Nanowires