2019
DOI: 10.1016/j.compositesa.2019.05.019
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Flexible and lightweight microcellular RGO@Pebax composites with synergistic 3D conductive channels and microcracks for piezoresistive sensors

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Cited by 63 publications
(39 citation statements)
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“…[ 7 ] Furthermore, the inherent properties of CPCs make them attractive as a potential alternative to metals in the electronics industry for electromagnetic shielding [ 8–10 ] and sensors. [ 11 ] Carbon‐based materials are lightweight and exhibit excellent mechanical properties and thermal stability, and have broad applications as fillers, including in electrodes for supercapacitors [ 12,13 ] and batteries [ 14,15 ] and environmental protection. [ 16 ] The commonly used conductive fillers in CPCs, such as conductive carbon black, [ 17 ] carbon fibers, [ 18 ] carbon nanotubes, [ 8,19 ] graphene, [ 20,21 ] and noble metal nanowires, [ 22,23 ] benefit from their light weight, high specific surface area, and high conductivity.…”
Section: Introductionmentioning
confidence: 99%
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“…[ 7 ] Furthermore, the inherent properties of CPCs make them attractive as a potential alternative to metals in the electronics industry for electromagnetic shielding [ 8–10 ] and sensors. [ 11 ] Carbon‐based materials are lightweight and exhibit excellent mechanical properties and thermal stability, and have broad applications as fillers, including in electrodes for supercapacitors [ 12,13 ] and batteries [ 14,15 ] and environmental protection. [ 16 ] The commonly used conductive fillers in CPCs, such as conductive carbon black, [ 17 ] carbon fibers, [ 18 ] carbon nanotubes, [ 8,19 ] graphene, [ 20,21 ] and noble metal nanowires, [ 22,23 ] benefit from their light weight, high specific surface area, and high conductivity.…”
Section: Introductionmentioning
confidence: 99%
“…The carbon‐based filler is coated on the surface of each bead, and small quantities of carbon‐based filler can be coated evenly on the bead surfaces. In the molding process, common steam molding [ 11,69 ] was not carried out because it has a high operating cost and significantly deteriorates the physical and mechanical properties of the molded material. Even though the modified steam molding reduces the operating cost, the overall properties of the molded material are consistent with those molded by traditional steam molding.…”
Section: Introductionmentioning
confidence: 99%
“…Poly(ether‐block‐amide) (PEBA), that is, a block polymer, consists of polyether soft segments and polyamide hard segments to form a microphase separation morphology, meanwhile shows outstanding flexibility, elasticity, and outstanding elastic performance at minus tens of zero temperature. [ 24–27 ] Especially, PEBA has a unique amphiphilic property which endows itself potential anti‐fouling applications. [ 27 ] Compared to the common procedure to realize the anti‐fouling ability, such as adding hydrophilic fillers, chemical modification, and blending with hydrophilic polymers, [ 28,29 ] using an amphiphilic polymeric material avoid the migration of fillers and the following deterioration of anti‐fouling performance.…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, porous materials have been widely used in superhydrophobic materials, adsorption materials, electronics, and other fields owing to their porous, loose, and flexible characteristics [1][2][3]. Conductive porous materials have unique porous structure and demonstrate excellent electrical conductivity, enabling them to have a broad prospective application in various fields such as flexible sensing, electrochemistry, and supercapacitors [4][5][6]. However, conductive porous materials have their own limitations such as uneven pore size distribution and weak adhesion between the filler and pore structure.…”
Section: Introductionmentioning
confidence: 99%