Flexibilized Copolyimide Adhesives

Progar, D. J.; Clair, Terry L. St.

doi:10.1080/00218468708074958

Cited by 20 publications

(10 citation statements)

References 2 publications

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“…Various attempts have been made to overcome these deficiencies, including the use of noncoplanar or alicyclic monomers [7][8][9][10] and the introduction of flexible segments into the polymer backbone. [11][12][13] Methods for overcoming these deficiencies include reducing chain crystallinity, intermolecular charge-transfer, and electronic polarization interactions. An alternative approach involves incorporating pendant groups onto the rigid polyimide backbone.…”

Section: Introductionmentioning

confidence: 99%

Structural effects of pendant groups on thermal and electrical properties of polyimides

Wang

Chang

Cheng

2006

J of Applied Polymer Sci

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Two series of aromatic polyimides containing various-sized alkyl side groups were synthesized by thermal imidization of the poly(amic acid)s prepared from the polyaddition of benzophenonetetracarboxylic dianhydride and hexafluoro-isopropylidene bis(phthalic anhydride) with 4,4Ј-methylenedianiline, 4,4Ј-methylene-bis(2,6-dimethylaniline), 4,4Ј-methylene-bis(2,6-diethylaniline), and 4,4Ј-methylene-bis(2,6-diisopropylaniline). The extent to which alkyl substitutes affect the thermal properties of polyimides was examined by differential scanning calorimetry, thermomechanical analyzer, and thermogravimetric analysis techniques. The analytical results demonstrated that the incorporation of alkyl moieties causes a moderate increase in the coefficient of thermal expansion and a slight decrease in thermal stability. Notably, all polymers had a decomposition temperature exceeding 500°C. The glass transition temperature increases markedly when hydrogen atoms at ortho positions on aniline rings are replaced with methyl groups, but decreases with growing alkyl side group size. The dielectric measurements show that the polymer possessing a large alkyl side group would have the lower dielectric value.

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Section: Introductionmentioning

confidence: 99%

Structural effects of pendant groups on thermal and electrical properties of polyimides

Wang

Chang

Cheng

2006

J of Applied Polymer Sci

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“…After imidization, however, they have properties that inhibit processability, insolubility, intractability, and high glass transition temperature. [1][2][3][4] In the last decade, several copolyimides containing polyorganosiloxane in their copolymer backbone, as block units, have been prepared to improve processing, and they have been applied in high-performance adhesives and special coatings. [5][6][7][8] Recently, some copolyimides containing polyorganofluorosiloxane have been reported that exhibit low dielectric constants.…”

Section: Introductionmentioning

confidence: 99%

Preparation and properties of poly(methyltrifluoropropylsiloxane‐b‐imide) copolymer. I

Kang

Kim

2002

J of Applied Polymer Sci

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Poly(methyltrifluoropropylsiloxane-block-imide) copolymers (PSBPI), containing various contents of fluorosiloxane, were prepared by the thermal imidization of 3,3Ј,4,4Ј-benzophenonetetracarboxylic dianhydride (BTDA), 4,4Ј-oxydianiline (ODA), and ␣,-aminopropyl-terminated poly(methyltrifluoropropylsiloxane) prepolymer (APMFS). APMFS was prepared from an equilibrium polymerization of (3,3,3-trifluoropropyl)methylcyclotrisiloxane (D 3 Me,CH2,CH2,CF3 ) with 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane in the presence of the tetramethylammoniumhydroxide (TMAH) catalyst. The content of APMFS, in the reaction mixture, was varied from 0 to 30 wt % of diamine. The structure of copolymer was confirmed by FTIR spectroscopy. The thermal stability, linear coefficient of thermal expansion, modulus, X-ray pattern, and other properties, such as surface enrichment behavior and solubility, were investigated. PSBPI exhibited relatively low crystallinity regardless of the APMFS content in the copolymer. On the other hand, thermogravimetric, thermomechanical, dynamic mechanical, and surface properties were affected by the content of APMFS segment in the copolymer backbone.

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“…The 80 : 20 copolymer had the lowest moisture imide with excellent thermal, chemical, and mechanical properties. 19 However, its T g is too low uptake and a higher free volume than that of the ODPA/3,4-ODA. This indicated that there was and its CTE is too high for the proposed applications.…”

Section: Resultsmentioning

confidence: 98%

Dimensionally stable polyimide copolymers for microelectronics applications

Fay¹,

Clair²

1998

J. Appl. Polym. Sci.

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Polyimides are finding increased applications in microelectronics due to their high thermal stability, good chemical resistance, good adhesion, low moisture absorption, good mechanical properties, and low coefficient of thermal expansion (CTE). Four series of random copolyimides were synthesized and characterized for potential application as encapsulants, stress-relief layers, and interlevel dielectrics. Several candidates exhibited good combinations of physical and mechanical properties with inherent viscosities from 1.21 to 1.42 dL/g, T g 's ranging from 251 to 277ЊC, 10% weight loss temperatures between 503 and 527ЊC, and CTEs ranging from 33 to 39 ppm/ ЊC. Mechanical properties at room temperature for the best candidates included tensile strengths of 17.8-21.3 ksi, moduli between 388 and 506 ksi, and elongations of 11-43%. Moisture absorption for these copolyimides ranged between 0.85 and 1.38 wt %.

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Flexibilized Copolyimide Adhesives

Cited by 20 publications

References 2 publications

Structural effects of pendant groups on thermal and electrical properties of polyimides

Structural effects of pendant groups on thermal and electrical properties of polyimides

Preparation and properties of poly(methyltrifluoropropylsiloxane‐b‐imide) copolymer. I

Dimensionally stable polyimide copolymers for microelectronics applications

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