Flatness enhancement of the embedded interposer of 3D-ICs by using ring-type framework designs

Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint

“…The implementation of Pb-free electronic materials has increased the complexity of interconnection metallurgies. As mentioned in researches [1,2,3] the electronic industries are showing tendency to shift from 2D integrated circuits (ICs) to 3D ICs technology, the reliability of Sn-based solder alloys has attracted the attention of many researchers. Kumar et al [4] have performed a literature review of wetting behavior of liquid solders on Cu substrate and have outlined that the wetting properties of most of the lead-free solders are poorer than that of the conventional Sn-Pb eutectic solder.…”