2016
DOI: 10.1002/adma.201603473
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Flash‐Induced Self‐Limited Plasmonic Welding of Silver Nanowire Network for Transparent Flexible Energy Harvester

Abstract: The outstanding performance (sheet resistance of 5 Ω sq at transmittance of 90%) and strongly adhesive (30.7 J m ) silver nanowires (AgNWs) are fabricated using flash-induced plasmonic welding (FPW) based on theoretical research of photothermal interactions. The FPW-processed AgNWs are utilized as electrodes of a transparent flexible energy harvester, and this device exhibits excellent transmittance and high electric output performance. The FPW methodology provides a high-tech solution for transparent flexible… Show more

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Cited by 223 publications
(168 citation statements)
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“…Inset shows the AgNW/PET film after the FPW process. Reproduced with permission . Copyright 2017, Wiley‐VCH.…”
Section: Post‐printing Treatmentmentioning
confidence: 99%
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“…Inset shows the AgNW/PET film after the FPW process. Reproduced with permission . Copyright 2017, Wiley‐VCH.…”
Section: Post‐printing Treatmentmentioning
confidence: 99%
“…Photonic sintering is a good choice for low‐temperature, high‐speed, and large‐scale sintering of AgNW or CuNW networks . Lee and coworkers reported flash‐induced plasmonic welding (FPW) of AgNWs.…”
Section: Post‐printing Treatmentmentioning
confidence: 99%
See 1 more Smart Citation
“…Therefore, the welding of AgNWs to tighten AgNW contact is of significant importance to effectively improve the optoelectronic properties and mechanical flexibility of AgNW films. In the past decade, a variety of strategies have been devised to weld AgNWs to promote the optoelectronic properties and flexibility of AgNW films, including thermal heating, mechanical pressing, capillary‐force‐induced welding, chemical welding, and plasmonic welding . The heating and mechanical pressing processes can cause damage to the active structure of some devices .…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, there is a growing need to realize cost‐effective, large‐area, and large‐scale production of flexible electronics. Therefore, instead of silicon‐ or glass‐based conventional fabrications, various printing processes without the need for multiple manufacturing steps, the use of toxic etchants and rigid carrier substrate, and with the advantage of scalability have been developed . However, despite enormous efforts, they still suffer from difficulties in improving reliability, throughput, and pattern resolution.…”
Section: Comparison Of the Characteristics Of The Mesh‐patterned Ftcementioning
confidence: 99%