Fixture‐based industrial robot calibration for silicon wafer handling

Zhang, Mike Tao; Goldberg, Ken

doi:10.1108/01439910510573282

Cited by 6 publications

(3 citation statements)

References 13 publications

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“…delay Time Time (9) The control simulation of the monitoring station success rate is realized based on the theoretical receiving power and the test environment link fading simulation. Due to the inconsistency between the darkroom free space fading and the feeder fading under different simulation frequencies, the data-link should be calibrated according to test conditions before the test [5].The aim of the calibrate-link method is to reduce the effect of the environmental factors on the simulation test. The procedure of the calibrate-link method is as follows:…”

Section: Measurement Technology and Engineering Researches In Industrymentioning

confidence: 99%

Study on the Delay of UAV Data-Link Based on TDMA and Aloha Channel Access Protocol

Huang

2013

AMM

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The existing test method for properties of UAV data-link is usually the actual flight test or field "distance" test, which has long test cycle and difficulty for the extraction of test data. In view of this situation, we in this work adopted the data-link semi-physical simulation test platform based on darkroom calibrate-link method, establishing and analyzing the space natural decline model, atmospheric environment model, and aircraft attitude angle model that affecting the transmitting and receiving of signals. Meanwhile, the average delay from-terminal-to-terminal and the fluctuation of the average delay of the UAV under different MAC channel access protocols are discussed using the darkroom calibrate-link method. In order to improve the response characteristics of the UAV, time delay is compensated using optimal control methods, and the effectiveness of the compensation method is validated based on and the platform we built. The simulation results show that, the design of UAV data-link can be calculated by this theory, and the introduction of the optimal control method significantly improves the dynamic response characteristics of the UAV.

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Section: Measurement Technology and Engineering Researches In Industrymentioning

confidence: 99%

Study on the Delay of UAV Data-Link Based on TDMA and Aloha Channel Access Protocol

Huang

2013

AMM

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“…In a typical semiconductor manufacturing setting, wafers are transported in cassettes by guided vehicles and loaded into or unloaded from machines by wafer handling robots [1]. The critical dimension of features patterned in modern semiconductor manufacturing processes continues to decrease without a significant impact on manufacturing throughput.…”

Section: Introductionmentioning

confidence: 99%

A Low-Cost, Automated Wafer Loading System With Submicron Alignment Accuracy for Nanomanufacturing and Nanometrology Applications

Duenner

Yao

Hoyos

et al. 2016

Journal of Micro and Nano-Manufacturing

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This paper introduces a low-cost, automated wafer alignment system capable of submicron wafer positioning repeatability. Accurate wafer alignment is critical in a number of nanomanufacturing and nanometrology applications where it is necessary to be able to overlay patterns between fabrication steps or measure the same spot on a wafer over and over again throughout the manufacturing process. The system presented in this paper was designed to support high-throughput nanoscale metrology where the goal is to be able to rapidly and consistently measure the same features on all the wafers in a wafer carrier without the need for slow and expensive vision-based alignment systems to find and measure the desired features. The wafer alignment system demonstrated in this paper consists of a three-pin passive wafer alignment stage, a voice coil actuated nesting force applicator, a three degrees-of-freedom (DOFs) wafer handling robot, and a wafer cassette. In this system, the wafer handling robot takes a wafer from the wafer cassette and loads it on to the wafer alignment stage. The voice coil actuator is then used to load the wafer against the three pins in the wafer alignment system and align the wafer to an atomic force microscope (AFM)-based metrology system. This simple system is able to achieve a throughput of 60 wafers/h with a positional alignment repeatability of 283 nm in the x-direction, 530 nm in the y-direction, and 398 nm in the z-direction for a total capital cost of less than $1800.

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“…Even after mathematical modeling, calibration becomes susceptible to slight changes in setup. Consequently, only a few calibration methods have been practical, simple, economical and quick enough for use with industrial robots (Abderrahim & Whittaker, 2000;Hosek & Bleigh, 2002;Meng & Zhuang, 2001;Meng & Zhuang, 2007;Pena-Cabrera et al, 2005;Perks, 2006;Young & Pickin, 2000;Zhang & Goldberg, 2005;Zhang et al, 2006).…”

Section: Calibration Of Vision Systemmentioning

confidence: 99%