Fish &amp; chips: single chip silicon mems ctdl salinity, temperature, pressure and light sensor for use in fisheries research

Hyldgård, Anders; Hansen, Ole; Thomsen, Erik Vilain

doi:10.1109/memsys.2005.1453927

Cited by 12 publications

(10 citation statements)

References 4 publications

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“…The four sensors gives together information about the salinity of the water, depth, temperature, day and night together with information about longitude and latitude. The performance of the four sensors is described and analysed in details elsewhere [4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Enhanced polymeric encapsulation for MEMS based multi sensors for fisheries research

Birkelund

Nørgaard

Thomsen

2011

Sensors and Actuators A: Physical

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Section: Introductionmentioning

confidence: 99%

Enhanced polymeric encapsulation for MEMS based multi sensors for fisheries research

Birkelund

Nørgaard

Thomsen

2011

Sensors and Actuators A: Physical

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“…The monolithic multi-sensor is important for minimizing system size, simplifying the configuration of the system and reducing the cost of the system. These multi-sensors have also been developed in wide range of application fields, extending from environmental monitoring [4,5] to industrial automation [6,7] and chemical analysis [8], etc. Among them, some multi-sensors had applied SOI material to improve the environment adaptability of silicon devices, especially for temperature adaptability, because the SiO 2 buried layer under the active silicon in the SOI wafer can provide very good electrical insulation from the silicon substrate to avoid the effect of the leakage current in the piezojunction and reduce the thermal noise of device [9,10].…”

Section: Introductionmentioning

confidence: 99%

A monolithic silicon multi-sensor for measuring three-axis acceleration, pressure and temperature

Zhao

Jiang

et al. 2008

J Mech Sci Technol

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A monolithic multi-sensor for small unmanned aerial vehicles is presented in the paper; it consists of a three-axis piezoresistive accelerometer, a piezoresistive absolute pressure sensor and a silicon thermistor temperature sensor. The accelerometer is designed with four silicon beams supporting the seismic mass and appropriate piezoresistors arrangement to detect three-axis acceleration and greatly reduce cross-axis sensitivities. For minimizing the effect of stress on the temperature sensor, the thermistor is designed along [100] and [010] crystal orientation. The multi-sensor is fabricated on SOI wafers by using MEMS bulk-micromachining technology. Some effective micromachining steps are applied in the fabrication. The two-step wet anisotropic etching process on the backside of the wafers can form the whole backside shape of the multi-sensor. The metal electrode sputtered on the Pyrex glass can avoid sticking between the Pyrex glass and the seismic mass in the process of anodic bonding. The die size of the multi-sensor is 4×6×0.9mm 3 . The measured results show that the multi-sensor is appropriate for its application field.

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“…This method makes complex stress analysis possible in microscale packaging. The packaging concept analysed is used to protect chip and electronics in a multisensor system developed for fisheries research [4].…”

Section: Introductionmentioning

confidence: 99%

Determination of packaging induced 3D stress utilizing a piezocoefficient mapping device

Richter

Hyldgård

Birkelund

et al. 2007

2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)

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This paper presents a novel method to determine 3D stress in microsystem packaging. The stress components σ xx , σ yy , σ zz , and σ xy are found in an epoxy package using a piezocoefficient mapping device as stress sensor. We spin the current 360 o in a circular n-type (001) Si piezoresistor by contacts located near the perimeter of the resistor and do high impedance voltage measurements on contacts located near the centre of the resistor. By measuring the potential drops in these contacts we can determine the stress in the chip. The epoxy is potted in a polystyrene tube using the same concept as in [1] used for chip packaging for fisheries research. We investigate the EpoTek 305 epoxy and find stress values of σ xx ≈ -23 MPa, σ yy ≈ -1 MPa, σ xy ≈ 0.3 MPa, and σ zz ≈ 40 MPa. The presented method can be used for 3D stress measurements of various packaging concepts.

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Fish & chips: single chip silicon mems ctdl salinity, temperature, pressure and light sensor for use in fisheries research

Cited by 12 publications

References 4 publications

Enhanced polymeric encapsulation for MEMS based multi sensors for fisheries research

Enhanced polymeric encapsulation for MEMS based multi sensors for fisheries research

A monolithic silicon multi-sensor for measuring three-axis acceleration, pressure and temperature

Determination of packaging induced 3D stress utilizing a piezocoefficient mapping device

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