First-principles investigation of the structural and electronic properties of Cu6−xNixSn5 (x=0, 1, 2) intermetallic compounds

Yu, Chun; Liu, Junyan; Lü, Hao; Li, Peilin; Chen, Junmei

doi:10.1016/j.intermet.2007.05.005

Cited by 105 publications

(61 citation statements)

References 35 publications

(27 reference statements)

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“…Gao et al have shown, based on thermodynamic calculation, that (Cu, Ni) 6 Sn 5 is more stable than Cu 6 Sn 5 [32] . Yu et al have also obtained the similar results [33]. It was also verified by FESEM and EDX analysis elsewhere [34].…”

Section: Discussionsupporting

confidence: 61%

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

et al. 2015

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The characteristics of interfacial intermetallic compounds (IMCs) can have serious impact on the reliability of solder joints. In this study, Ni nanoparticles (NPs) were added to SAC305 solder/Cu substrate interface by flux mixing. The effects of Ni NP addition on electromigration (EM) under high current density were investigated. EM tests with a maximum duration of 1128 h were conducted under a current density of 1 9 10 4 A/cm 2 , at 80 ± 3°C on the solders prepared using 0 and 2 wt% Ni NPs-doped flux. At 2 wt% Ni NPs addition to flux, the growth rate of interfacial IMC at the anode side decreased by more than five times. No significant change in electrical resistance was observed in 2 wt% samples for up to 1128 h. Ni NP addition at the solder/substrate through flux mixing is, therefore, expected to lead to more reliable solder joints.

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Section: Discussionsupporting

confidence: 61%

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

et al. 2015

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“…Oberndorff 21 established an isothermal section at 235°C and reported the existence of a ternary phase Cu 27 Ni 29 Sn 44 . Yu et al 22 performed first-principle calculations along Cu 6-x Ni x Sn 5 and found an ordering of Cu and Ni atoms at the composition of Cu 4 Ni 2 Sn 5 . They assumed Cu 4 Ni 2 Sn 5 to be a ternary intermetallic compound but did not give any information on corresponding phase equilibria or phase transitions.…”

Section: The System Cu-ni-snmentioning

confidence: 99%

Cu-Ni-Sn: A Key System for Lead-Free Soldering

Schmetterer

Flandorfer

Luef

et al. 2008

Journal of Elec Materi

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Being the most complex constituent of the quaternary system Ag-Cu-Ni-Sn, the ternary system Cu-Ni-Sn is the key system for the investigation of the interactions of Ag-Cu-Sn solder alloys with Ni as a contact material. Although this system has been thoroughly studied in the literature, there are still many uncertainties left. In the present work, a study of the phase equilibria in four isothermal sections at 220, 400, 500, and 700°C of the Cu-Ni-Sn system was carried out following a comprehensive literature study. The methods employed were x-ray diffraction (XRD), metallography, and scanning electron microscopy including electron probe microanalysis. The ternary solubilities of the Ni 3 Sn 2 -Cu 6 Sn 5 and Ni 3 Sn-Cu 3 Sn fields were characterized in detail. So far no continuous solubility between the respective phases has been found. At 25 at.% Sn the existence of two ternary compounds formed from the BiF 3 -type (Cu,Ni) 3 Sn phase and reported in literature could be confirmed. On the other hand, our results differ significantly from the very recent literature related to lead-free soldering.

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“…8b that Cu 3 Sn phases closely attached to the Cu pillar, (Cu,Ni) 6 Sn 5 , and Ni at the location where Ni was 18 proposed that (Cu,Ni) 6 Sn 5 may share a monoclinic lattice structure similar to that of Cu 6 Sn 5 , which is considered to be structurally unstable compared to the face-centered cubic (FCC) close-packed lattice structure of Cu 3 Sn. 19 It is well known that g-Cu 6 Sn 5 undergoes a transformation into e-Cu 3 Sn by the requirement of thermodynamic equilibrium in conventional Sn-Pb solder systems.…”

Section: Electromigration Reliability and Morphologiesmentioning

confidence: 99%

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

Lai

Chiu

Chen

2008

Journal of Elec Materi

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The Cu pillar is a thick underbump metallurgy (UBM) structure developed to alleviate current crowding in a flip-chip solder joint under operating conditions. We present in this work an examination of the electromigration reliability and morphologies of Cu pillar flip-chip solder joints formed by joining Ti/Cu/Ni UBM with largely elongated $62 lm Cu onto Cu substrate pad metallization using the Sn-3Ag-0.5Cu solder alloy. Three test conditions that controlled average current densities in solder joints and ambient temperatures were considered: 10 kA/cm 2 at 150°C, 10 kA/cm 2 at 160°C, and 15 kA/cm 2 at 125°C. Electromigration reliability of this particular solder joint turns out to be greatly enhanced compared to a conventional solder joint with a thinfilm-stack UBM. Cross-sectional examinations of solder joints upon failure indicate that cracks formed in (Cu,Ni) 6 Sn 5 or Cu 6 Sn 5 intermetallic compounds (IMCs) near the cathode side of the solder joint. Moreover, the $52-lm-thick Sn-Ag-Cu solder after long-term current stressing has turned into a combination of $80% Cu-Ni-Sn IMC and $20% Sn-rich phases, which appeared in the form of large aggregates that in general were distributed on the cathode side of the solder joint.

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First-principles investigation of the structural and electronic properties of Cu6−xNixSn5 (x=0, 1, 2) intermetallic compounds

Cited by 105 publications

References 35 publications

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

Cu-Ni-Sn: A Key System for Lead-Free Soldering

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

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