2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 2023
DOI: 10.1109/ectc51909.2023.00333
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First Demonstration of Die-embedded Alumina Ribbon Ceramic (ARC) Packaging for 6G Wireless Applications

Joon‐Woo Kim
1
,
Nahid Aslani-Amoli
2
,
Fuhan Liu
3
et al.
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