Finite Element modelling of adhesion phenomena in MEMS

Ardito, Raffaele; Corigliano, Alberto; Frangi, Attilio

doi:10.1109/esime.2010.5464550

Cited by 6 publications

(4 citation statements)

References 18 publications

(23 reference statements)

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“…As for the silicon-gold contact model, the main parameters are listed in Table 1 [15,27], and the thickness of Au layer is 40 nm. Thus, the equivalent curvature radius is 1515 nm and the equivalent elastic module is 56.02 Gpa.…”

Section: Model Of Contacting Areamentioning

confidence: 99%

“…Pennec et al indicated the dependence of contact characteristics on the surface roughness [14]. Ardito et al concentrated mainly on the surface contact phenomenon of MEMS devices and finished the corresponding physical model under different environmental conditions [15]. Cui et al established a multi-scale model of rough surface contact and calculated the deformation level of the surface under pressure [16].…”

Section: Introductionmentioning

confidence: 99%

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Investigation of the Contact Characteristics of Silicon–Gold in an Anodic Bonding Structure

et al. 2022

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Anodic bonding is broadly utilized to realize the structure support and electrical connection in the process of fabrication and packaging of MEMS devices, and the mechanical and electrical characteristics of the bonded interface of structure exhibit a significant impact on the stability and reliability of devices. For the anodic bonding structure, including the gold electrode of micro accelerometers, the elastic/plastic contact model of a gold–silicon rough surface is established based on Hertz contact theory to gain the contact area and force of Gauss surface bonding. The trans-scale finite element model of a silicon–gold glass structure is built in Workbench through the reconstruction of Gauss surface net by the reverse engineering technique. The translation load is added to mimic the process of contact to acquire the contact behaviors through the coupling of mechanical and electrical fields, and then the change law of contact resistance is obtained. Finally, the measurement shows a good agreement between the experimental results, theoretical analysis and simulation, which indicates there is almost no change of resistance when the surface gap is less than 20 nm and the resistance is less than 5Ω, while the resistance changes rapidly after the gap exceeds 20 nm.

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Section: Model Of Contacting Areamentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Investigation of the Contact Characteristics of Silicon–Gold in an Anodic Bonding Structure

et al. 2022

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“…They assumed a constant adhesive force between the contacting surfaces, which is not always rigorous and has less physical basis. For completeness, another approach is to consider finite element simulations of a reduced number of interacting asperities combined with capillary and van der Waals forces interactions, [29].…”

Section: Introductionmentioning

confidence: 99%

A Micro–Macroapproach to Predict Stiction due to Surface Contact in Microelectromechanical Systems

Noels

Rochus

et al. 2011

J. Microelectromech. Syst.

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Abstract-Stiction, which results from contact between surfaces, is a major failure mode in micro electro-mechanical systems (MEMS). Indeed microscopic structures tend to adhere to each other when their surfaces enter into contact and when the restoring forces are unable to overcome the interfacial forces. Since incidental contacts cannot be completely excluded and since contacts between moving parts can be part of the normal operation of some types of MEMS, stiction prediction is an important consideration when designing micro and nano-devices. In this paper a micro-macro multi-scale approach is developed in order to predict possible stiction. At the lower scale, the unloading adhesive contact-distance curves of two interacting rough surfaces are established based on a previously presented model [L. Wu et al., J. Appl. Phys. 106, 113502, 2009]. In this model, dry conditions are assumed and only the van der Waals forces as adhesion source are accounted for. The resulting unloading adhesive contact-distance curves are dependant on the material and on surface properties, such as, elastic modulus, surface energy and on the rough surfaces topography parameters; the standard deviation of asperity heights and the asperities density. At the higher scale, a finite element analysis is considered to determine the residual cantilever beam configuration due to the adhesive forces once contact happened. Toward this end, the adhesive contact-distance curve computed previously is integrated on the surface of the finite elements as a contact law. Effects of design parameters can then be studied for given material and surface properties.

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“…The generalization to two rough surfaces can be conducted by finite element simulations where the surfaces are discretized, as it has been proposed for elastoplastic asperities by Pei et al [34] without accounting for adhesion, or by Ardito et al [35] with capillary and VDW effects. The treatment of rough surfaces can also be obtained from the single asperity study, by extending the GW-elastic formulation and by using the CEB single asperity model, [20].…”

Section: Introductionmentioning

confidence: 99%

A micro-model for elasto-plastic adhesive–contact in micro-switches: Application to cyclic loading

Golinval

Noels

2013

Tribology International

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Stiction is a major failure mode in micro-electromechanical systems. In previous works, a statistical rough surfaces interaction model, for which only elastic adhesive contact has been considered, was developed for multiscale analyzes.However, during the impact between rough surfaces, plastic deformations of asperities cannot always be neglected. In the present work, the adhesion between rough surfaces is studied considering the elasto-plastic deformations of the asperities, and a model predicting the resulting micro adhesive-contact forces is derived.For illustration purpose, an electrostatic-structural analysis is performed on a micro-switch. To determine the degree of plasticity involved, the impact energy of the movable electrode at pull-in is estimated. Thus the maximal adhesive force evolution during cyclic loading is predicted using the developed model.

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Finite Element modelling of adhesion phenomena in MEMS

Cited by 6 publications

References 18 publications

Investigation of the Contact Characteristics of Silicon–Gold in an Anodic Bonding Structure

Investigation of the Contact Characteristics of Silicon–Gold in an Anodic Bonding Structure

A Micro–Macroapproach to Predict Stiction due to Surface Contact in Microelectromechanical Systems

A micro-model for elasto-plastic adhesive–contact in micro-switches: Application to cyclic loading

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