Finite element modeling of electric current-activated sintering: The effect of coupled electrical potential, temperature and stress

Wang, X.; Casolco, S.R.; Xu, Guanshui; Garay, Javier E.

doi:10.1016/j.actamat.2007.02.022

Cited by 97 publications

(60 citation statements)

References 16 publications

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“…Heat was generated while electrical current flowing through all components of SPS apparatus, the temperature showed in the thermocouple increased from 35. 6 C to 590 C in 5 mins, and the holding time was 10 mins at 590 C before turning off the power and removing the pressure. Finally, the disk shaped Mo/Ti/CoSb 3 multi-layer sample was simultaneously prepared by one-step SPS sintering process in a vacuum.…”

Section: Methodsmentioning

confidence: 99%

“…Despite this simplification, the results serve to shed light on the important consequences of temperature distributions in the SPS process. 6) A schematic of the spark plasma sintering apparatus used in the experiments and simulation was shown in Table 3.…”

Section: Finite Element Simulationmentioning

confidence: 99%

“…In the simulation, the initial temperature of the whole system was set to be 35. 6 C, the boundary temperature at the top, bottom water-cooled electrodes and surrounding environment were kept at a constant temperature of 35.6 C according to the actual temperature in experiments. Uniform pressures showed in Table 2 were applied on the top boundary, and zero vertical displacements were assumed for the bottom boundary.…”

Section: Finite Element Simulationmentioning

confidence: 99%

“…4,5) Recently, there have been some works in simulating temperature distribution of sample during SPS process, including conducting and insulating materials. 1,4,6,7) However, for semi-conducting material used as thermoelectric (TE) devices, the thermoelectric property is sensitive to temperature, and mechanical property is relevant with temperature distribution in sample, thus it is necessary to study the temperature distribution and evolution of semi-conducting material during Spark Plasma Sintering.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Modeling Temperature Gradient Evolution of CoSb<SUB>3</SUB> Material for Thermoelectric Devices during Spark Plasma Sintering

Cai

Zhao

et al. 2009

Mater. Trans.

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The temperature distribution and evolution of Mo/Ti/CoSb 3 materials used as thermoelectric couples of devices during spark plasma sintering were simulated by finite element method, and the results agree well with the die interior temperature measured by thermocouple. The sample and punches have higher temperature in whole sintering process, the highest temperature region is existed in CoSb 3 region, and the radial temperature gradient in CoSb 3 region is obvious. It was confirmed by experiments that the temperature gradient in sample results in non-uniform microstructure and thermal conductivity difference. The temperature gradient increases with decreasing thermal conductivity and increasing electrical resistivity of CoSb 3 -based compound, from the point of view of the thermal conductivity and electrical resistivity, respectively, the optimization method of the combined mechanical property and thermoelectric property of CoSb 3 -based compound was proposed.

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Section: Methodsmentioning

confidence: 99%

Section: Finite Element Simulationmentioning

confidence: 99%

Section: Finite Element Simulationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Modeling Temperature Gradient Evolution of CoSb<SUB>3</SUB> Material for Thermoelectric Devices during Spark Plasma Sintering

Cai

Zhao

et al. 2009

Mater. Trans.

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“…It is emphasized that the reliability of the model prediction highly depends on the correct modeling of the contact resistances between the tools and between tools and powder. [25] investigated the electrical, temperature and stress fields in order to evaluate stress gradients in the fully condensed sample (copper and alumina). Thus, the densification process is not treated.…”

Section: Introductionmentioning

confidence: 99%

Field Assisted Sintering Technology, Part II: Simulation

Rothe

Hartmann

2017

GAMM-Mitteilungen

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Field-assisted sintering technology (FAST) implies a multifield problem between electrical, thermal and mechanical fields. Based on a constitutive model proposed in [1], the numerical treatment of the three-field problem in a monolithic finite element framework is discussed. Apart from algorithmic considerations, numerical simulations are performed treating the complex contact problem, large deformations and the multifield issues themselves. This is combined with a PID-controller, which is required when the temperature process is given at specific positions in the graphite tool system and the electrical current is uncertain. The numerical simulations are validated by real experiments.

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Numerical Simulation of the Temperature and Stress Field Evolution Applied to Spark Plasma Sintering

Allen

Walters

Welch

et al. 2012

Developments in Strategic Materials and Computational Design III

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Finite element modeling of electric current-activated sintering: The effect of coupled electrical potential, temperature and stress

Cited by 97 publications

References 16 publications

Modeling Temperature Gradient Evolution of CoSb<SUB>3</SUB> Material for Thermoelectric Devices during Spark Plasma Sintering

Modeling Temperature Gradient Evolution of CoSb<SUB>3</SUB> Material for Thermoelectric Devices during Spark Plasma Sintering

Field Assisted Sintering Technology, Part II: Simulation

Numerical Simulation of the Temperature and Stress Field Evolution Applied to Spark Plasma Sintering

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