2019
DOI: 10.1007/s00170-019-04542-z
|View full text |Cite
|
Sign up to set email alerts
|

Finite element analysis of ultrasonic assisted milling of SiCp/Al composites

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

0
9
0

Year Published

2020
2020
2024
2024

Publication Types

Select...
9

Relationship

0
9

Authors

Journals

citations
Cited by 33 publications
(9 citation statements)
references
References 20 publications
0
9
0
Order By: Relevance
“…Owing to a series of excellent properties, including lightweight, superior wear resistance, and small thermal expansion coefficient, SiC p /Al composite thin-walled workpieces have been employed in a wide range of applications, such as automobiles, electronics, weapons, and aerospace. 1,2 However, the thin-walled workpieces still show some shortcomings during machining, such as poor rigidity and high material removal area. In addition, because of the presence of SiC particles, the processing mechanism of composites is different from that of single metal material.…”
Section: Introductionmentioning
confidence: 99%
“…Owing to a series of excellent properties, including lightweight, superior wear resistance, and small thermal expansion coefficient, SiC p /Al composite thin-walled workpieces have been employed in a wide range of applications, such as automobiles, electronics, weapons, and aerospace. 1,2 However, the thin-walled workpieces still show some shortcomings during machining, such as poor rigidity and high material removal area. In addition, because of the presence of SiC particles, the processing mechanism of composites is different from that of single metal material.…”
Section: Introductionmentioning
confidence: 99%
“…SiC p /Al is a composite material with high specific stiffness, specific strength, and thermal conductivity, and a low thermal expansion coefficient. Therefore, it is widely used in precision optical instruments, advanced weapons, and the aerospace field [1][2][3][4]. In the aerospace field, SiC p / Al is widely used in optical structure components and electronic packaging systems.…”
Section: Introductionmentioning
confidence: 99%
“…Using ABAQUS finite element software, Li et al [ 5 ] established a two-dimensional simulation model of single particles, homogeneous materials, and multiple particles as well as the process of particle rupture in the processing of a large number of SiCp/Al composites under various processing parameters and investigated the temperature change. According to Xiang et al [ 6 ], since the processing parameters are highly associated with the surface properties, a finite element simulation analysis of the processing of SiC particles was performed to investigate the effect of various ultrasonic amplitudes on the surface properties of SiCp/Al materials. A comparative study was carried out to confirm the accuracy of ULTM and existing machining theory and simulation.…”
Section: Introductionmentioning
confidence: 99%