Finite element analysis of the package structure of HgCdTe infrared focal plane array detector

Abstract

Reliable material parameters, correct boundary condition settings, and a reasonably simplified numerical model are key to obtain reliable and reasonable analysis results. A new finite element analysis model for the HgCdTe infrared focal plane array detector is presented, which includes the core column. The thermal stress and strain of the new model and current model are analyzed, and their distribution laws are obtained. The results are compared, and the reasons are analyzed, which can provide some references for the simulation of infrared detector package structure.