Finite Element Analysis of Gold Bonding under Different Loading Conditions

Abstract

In this paper, ANSYS-LSDYNA simulation software is used to build the three-dimensional finite element model of the ball bond and to get the Von Mises stress. The change of stress about the bump is researched which base on the model in different bonding pressure, bonding power and bonding time. The result show that: The stress increase with bonding pressure increase within a certain bonding pressure range, and then the stress will maintain a table number, however, the stress will continue to increase when the bonding pressure reach a certain value; increasing the bonding power, the area of lager stress will grow; prolonging the bonding time, the stress of the pad will increase with time, but when time increase to a certain value, the stress of the pad will not increase over time.