Finite-element analysis of a PBGA assembly under isothermal/mechanical twisting loading

Board level investigation of BGA solder joint deformation strength

“…This degree of stress being needed for cracking BGA joints in our example and which mainly occurred at the corners of the package. This result compares in order with other literature data [8], and approximately twice larger than the nominal shear stress of a lead-bearing alloy, which is 41 MPa [12]. Therefore the method of determining the stress in case of complex, assembled circuit boards is considered as the right approach.…”

“…Although in some works the PCB is considered as orthotropic (different mechanical parameters in main directions) the effect of the adjacent SMD components and the layout of the interconnection layers have not been taken into consideration [8,9].…”

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling

“…Care must be taken in controlling the element thickness at the interface between the solder joint and silicon chip or substrate. Some researchers have discussed the effect of mesh density on the solder joint fatigue life predictions, such as Yang et al [30]. Based on DarveauxÕs paper [29], two thin finite element layers with a thickness of 0.0254 mm was defined at the top and bottom of two solder joint in finite element model.…”

Optimization of pin through hole connector in thermal fluid–structure interaction analysis of wave soldering process using response surface methodology

“…The coupled temperature displacement was considered for thermal coupling analysis [27]. The mechanical properties of PTH were defined as elastic isotropic materials [28] and are as follows: Young's modulus, E = 129,930 Mpa; Poisson's ration, t = 0.34; expansion coefficient alpha; CTE (ppm/K) = 16.8.…”