Finite element analysis and simulation of rheological properties of bulk molding compound (BMC)

ERGİN, Mustafa; Aydın, İsmail

doi:10.1063/1.4849253

Cited by 1 publication

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“…Viscosity is also influenced primarily by temperature and shear rate. Therefore, the rheological behavior of molding compounds is important for numerical modeling of the molding process [4]- [5]. To characterize the rheokinetic behaviors of mold compound material properties, viscosity, curing kinetics, and thermal conductivity were measured.…”

Section: Rheokinetic Characteristic Of Mold Compound Materialsmentioning

confidence: 99%

Behaviors of QFN Packages on a Leadframe Strip

Ouyang¹,

Ahn²,

Chow³

et al. 2016

International Symposium on Microelectronics

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To lower the manufacturing cost of quad flat no-lead (QFN) packages, the number of QFN packages on a leadframe must be increased. However, the increased number of packages or changes to the layout of QFN packages on the leadframe can impact the mold compound flow behavior, which will, in turn, affect warpage, and the generation of voids inside the mold compound. In this paper, both simulation and experimental approaches were conducted to study the behaviors of QFN packages on a leadframe strip. For simulation, we will demonstrate and present an analysis methodology to account for the in-line processing parameters, especially the step of manufacturing and processing the mold compound material to form the QFN packages on a leadframe strip. The in-line manufacturing parameters, such as pressure, temperature, shrinkage, and processing timing, were all considered and modeled. A commercial finite element tool was used. For the experiment, we measured the warpages and the voids of QFN packages as a function of the package location on the leadframe. The warpage of the package, and the voids generation of QFN packages at different locations on the leadframe strip were studied. In conclusion, the experiment vs. modeling data was correlated, and the study proved to be very useful for the prediction of warpage, and void generations.

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Section: Rheokinetic Characteristic Of Mold Compound Materialsmentioning

confidence: 99%