2015
DOI: 10.1007/978-3-662-48324-4_32
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Finding the AES Bits in the Haystack: Reverse Engineering and SCA Using Voltage Contrast

Abstract: In this paper, we demonstrate how the Scanning Electron Microscope (SEM) becomes a powerful tool for Side Channel Analysis (SCA) and Hardware Reverse Engineering. We locate the AES hardware circuit of a XMEGA microprocessor with Capacitive-Coupled Voltage Contrast (CCVC) images and use them in a powerful Voltage Contrast Side Channel Analysis (VCSCA). This enables an attacker to locate AES bit-wires in the top metal-layer and thus, to recover valuable netlist information. An attacker gets a valuable entry-poin… Show more

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Cited by 7 publications
(6 citation statements)
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“…The end entities in an IoT system are billions of hardware devices, which could be RFID tags, sensor devices, barcodes, or 2D codes residing in personal area networks, home area networks, or industrial automation networks using quite different network protocols [Levis 2015]. There are a variety of existing methods of hardware attacks targeting these IoT end entities, including glitching [Korczyc and Krasniewski 2012], power analysis [Lerman et al 2014], UV attacks , microscopy [Stellari et al 2014], fault injection [Delvaux and Verbauwhede 2014], voltage contrast [Kison et al 2015], magnetic scan [Skorobogatov 2014], and reverse engineering ]. Most of the aforementioned attacks can also be categorized into side-channel attacks, which break the system security based on an extra source of information from hardware, such as power consumption, electromagnetic leaks, or even sound [Rostami et al 2014].…”
Section: Securitymentioning
confidence: 99%
“…The end entities in an IoT system are billions of hardware devices, which could be RFID tags, sensor devices, barcodes, or 2D codes residing in personal area networks, home area networks, or industrial automation networks using quite different network protocols [Levis 2015]. There are a variety of existing methods of hardware attacks targeting these IoT end entities, including glitching [Korczyc and Krasniewski 2012], power analysis [Lerman et al 2014], UV attacks , microscopy [Stellari et al 2014], fault injection [Delvaux and Verbauwhede 2014], voltage contrast [Kison et al 2015], magnetic scan [Skorobogatov 2014], and reverse engineering ]. Most of the aforementioned attacks can also be categorized into side-channel attacks, which break the system security based on an extra source of information from hardware, such as power consumption, electromagnetic leaks, or even sound [Rostami et al 2014].…”
Section: Securitymentioning
confidence: 99%
“…Also knowing the Region of Interest (ROI) is beneficial as the planar surface can be reduced significantly. In such cases, the reverse engineer can pinpoint his ROI while neglecting the rest of the chip [16]. Furthermore, every chip has different chip manufacturing processes due to cost optimizations or technology node requirements.…”
Section: B Chip-level Reverse Engineeringmentioning
confidence: 99%
“…Also knowing the Region of Interest (ROI) is beneficial as the planar surface can be reduced significantly. In such cases, the reverse engineer can pinpoint his ROI while neglecting the rest of the chip [16].…”
Section: B Chip-level Reverse Engineeringmentioning
confidence: 99%
“…Indeed, when the noise is normal and independent from one trace to the other, the SNR increases linearly with the number of collected traces. Alternatively, new side-channels, such as photonic analysis [23] or voltage contrast microscopy [16], can also overcome the decreasing feature size of recent CMOS technologies. -For fault injection attacks:…”
Section: "Cmos Scaling" Factormentioning
confidence: 99%