Handbook of Vacuum Arc Science and Technology 1996
DOI: 10.1016/b978-081551375-9.50018-7
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Film growth

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Cited by 2 publications
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“…The deposition of TiN film by cathodic arc evaporation is achieved by reactively evaporating a pure Ti cathode in the presence of a high partial pressure of nitrogen. A degree of control over the mechanical properties of the films is achievable by varying substrate temperature, substrate bias, and partial pressure of nitrogen [44].…”
Section: Cathodic Arc Evaporation Principlesmentioning
confidence: 99%
“…The deposition of TiN film by cathodic arc evaporation is achieved by reactively evaporating a pure Ti cathode in the presence of a high partial pressure of nitrogen. A degree of control over the mechanical properties of the films is achievable by varying substrate temperature, substrate bias, and partial pressure of nitrogen [44].…”
Section: Cathodic Arc Evaporation Principlesmentioning
confidence: 99%