Film deposition in a radial flow reactor by plasma polymerization of hexamethyldisilazane

Abstract

Polymeric substrates can be coated at low temperatures by means of an electric discharge fed by organic gases. Since both the composition and the structure of the deposited material can be varied in a wide range by the choice of starting compound and deposition conditions, the properties of the coatings can be adjusted specifically to fulfill many required demands. After a general introduction of the deposition method, a typical deposition apparatus is described and an optimization procedure of the deposition process is proposed. The intermediate position of plasma polymerized materials between common polymers and amorphous solids is demonstrated for films from hexamethyldisilazane. Based on the assumption of a continuous random network structure the density of covalent bonds and the total volume fraction of micro-voids can be evaluated and compared with application relevant properties such as mechanical stiffness and gas permeability. The model of a continuous random network structure may be valid for plasma polymerized material in general.

Deposition of Fluorinated a ‐ SiC : H Films at Room Temperature

“…However, there is some evidence in the literature that high quality film can be obtained at low temperatures by using ion bombardment. 35 '36 The ion bombardment removes weakly bound species and densities the filmY Dilution of the source gas with hydrogen is also effective in obtaining good quality films. 3a The hydrogen helps remove weak bonds by preferential etching, 39 and increase the surface mobility of the adsorbed precursors.…”

Scanning probe microscopy and nanoindentation studies of silicon carbonitride films obtained by PECVD from hexamethyldisilazane

“…Results of combustion elemental analysis for the sample, deposited at 70°C, give mean coordination number r =2.23, which is specific for «polymeric glasses» [11][12][13]. All these data allow concluding that low temperature films are organosilicon plasma polymer films [14,15]. Concentration of hydrogen-containing bonds tends to decrease with the temperature rise ( fig.1), and at high temperatures (more than 500°C), inorganic composite SiC x N y material, containing only Si-C and Si-N bonds, is formed [4,5].…”

Produção de filmes compósitos a partir de tetraetilortossilicato para aplicação em estruturas miniaturizadas e em detecção de VOCs/umidade.

“…Observe-se que o plasma aqui considerado é aquele útil para processos CVD (Chemical Vapor Deposition -Deposição Química em Fase Vapor), que apresenta uma característica de baixa densidade, ou seja, o número de partículas carregadas é muito menor que o de partículas neutras, com temperaturas eletrônicas muito maiores que as temperaturas iônicas (GERSTENBERG, 1990).…”

“…Entre as diversas fontes para obtenção de plasma, é comum o uso de fonte tipo DC que, (GRAYSON, 2004;WEIGL, 2003;LICHTENBERG, 2002). Alguns esforços foram feitos para a produção de filmes adsorventes por plasma, como o trabalho de KUROSAWA (1990) (GERSTENBERG, 1990;LAMENDOLA, 1998;PARK, 1990;NOVOTNY, 1989).…”

“…Dentre as propriedades mais utilizadas deste material está seu caráter hidrofóbico, que favorece a proteção de superfícies (MEX, 1998;FRANCKE, 1997), e as propriedades ópticas dos filmes produzidos LEE d , 2001;JOHNSON, 2001). Para proteção de superfícies, normalmente deseja-se filmes com pouca presença de radicais carbônicos, fator responsável pelo caráter hidrofóbico (D'AGOSTINO a , 1990;LIM, 2005;OHGISHI, 2003). No entanto, em filmes adsorventes, hidrofóbicos ou resistentes à radiação ultravioleta, a presença de radicais carbônicos é altamente desejável TAN b , 2001;PEREIRA, 2000).…”