2010 IEEE International SOI Conference (SOI) 2010
DOI: 10.1109/soi.2010.5641373
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Field Effect Resistor, a single-device-at-pad solution for ESD protection in deeply scaled SOI technology

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Cited by 2 publications
(1 citation statement)
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“…Various doping combinations have been simulated in TCAD to explore the impact of doping profile [39] helps reduce the gate voltage required to initiate the onset of inversion, thus the P-N-P-N structure (forward-blocking mode) in the silicon film is easier to form and sustain. For doping levels lower than 5 Â 10 16 , under 1 V gate bias, the leakage current is still negligible even when the anode voltage is increased to above 1 V.…”
Section: Further Improved Structuresmentioning
confidence: 99%
“…Various doping combinations have been simulated in TCAD to explore the impact of doping profile [39] helps reduce the gate voltage required to initiate the onset of inversion, thus the P-N-P-N structure (forward-blocking mode) in the silicon film is easier to form and sustain. For doping levels lower than 5 Â 10 16 , under 1 V gate bias, the leakage current is still negligible even when the anode voltage is increased to above 1 V.…”
Section: Further Improved Structuresmentioning
confidence: 99%