2019
DOI: 10.1002/smll.201901457
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Field‐Driven Athermal Activation of Amorphous Metal Oxide Semiconductors for Flexible Programmable Logic Circuits and Neuromorphic Electronics

Abstract: Despite extensive research, large‐scale realization of metal‐oxide electronics is still impeded by high‐temperature fabrication, incompatible with flexible substrates. Ideally, an athermal treatment modifying the electronic structure of amorphous metal oxide semiconductors (AMOS) to generate sufficient carrier concentration would help mitigate such high‐temperature requirements, enabling realization of high‐performance electronics on flexible substrates. Here, a novel field‐driven athermal activation of AMOS c… Show more

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Cited by 14 publications
(7 citation statements)
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“…The accompanying stochiometric transformations monitored through X-ray photoelectron spectroscopy provide critical insights into the underlying oxygen-vacancy generation mechanism and corroborates the comprehensive weight update analyses of the SWARMs (Supplementary Note 4, Supplementary Fig. 7) 32 . Figure 3 shows the characterization of SWARMs, the implemented STDP learning rule compared to biological synapses and higher-order associative learning fusing the information from STARs.…”
Section: And 5)supporting
confidence: 70%
“…The accompanying stochiometric transformations monitored through X-ray photoelectron spectroscopy provide critical insights into the underlying oxygen-vacancy generation mechanism and corroborates the comprehensive weight update analyses of the SWARMs (Supplementary Note 4, Supplementary Fig. 7) 32 . Figure 3 shows the characterization of SWARMs, the implemented STDP learning rule compared to biological synapses and higher-order associative learning fusing the information from STARs.…”
Section: And 5)supporting
confidence: 70%
“…Recently, a photoinduced neuromorphic device was developed based on metal oxide semiconductors. [ 147–152 ] Park et al. constructed the synaptic device using graphene oxide nanosheets modified with long alkyl chains embedded as a charge‐trapping layer on the IGZO TFTs as shown in Figure 13d.…”
Section: Future Convergence Technology Based On Metal Oxide Phototransistorsmentioning
confidence: 99%
“…The use of PI in electronic industry includes application in flexible printed circuit boards (FPCBs) where heat resistance and flexibility are required, 25 insulation of electric wires, 25 and intermetal dielectric (IMD) layer in integrated circuits (ICs). 26 PI is also typically employed as the major material for fabrication of flexible substrates in flexible electronics for oxide thin-film transistors (TFTs), 27 organic field-effect transistors (OFETs), 28 and amorphous metal oxide semiconductors 29 to name a few. Furthermore, in the majority of flexible electronic devices, in order to introduce functionalities into devices, metal oxide layers are typically integrated.…”
Section: Introductionmentioning
confidence: 99%