Field-configured self-assembly: manufacturing at the mesoscale

O’Riordan, Alan; Redmond, Gareth; Dean, Thierry; Pez, M.

doi:10.1016/s0928-4931(02)00226-6

Cited by 6 publications

(3 citation statements)

References 5 publications

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“…As shown in figure 13(c-i), O'Riordan et al recently reported a preliminary idea of the programmable electric self-assembly (i.e. field configured assembly, FCA [228,229]), where the electric fields can be configured by selective addressing receptor sites pre-patterned onto a silicon substrate. The silicon substrate consists of 4 × 4 circular arrays of receptor electrodes (100 µm diameter and 250 µm spacing) with counter electrodes (500 µm diameter) located at the four corners of each array (figure 13(c-ii)).…”

Section: Magnetic/electric Fluid Self-assemblymentioning

confidence: 99%

Mass transfer techniques for large-scale and high-density microLED arrays

Chen

Bian

et al. 2022

Int. J. Extrem. Manuf.

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Inorganic-based micro light-emitting diodes (microLEDs) offer more fascinating properties and unique demands in next-generation displays. However, the small size of microLED chip (1~100 µm) makes it extremely challenging for high efficiency and low cost to accurately, selectively integrate millions of microLED chips. Recent impressive technological advances have overcome the drawbacks of traditional pick-and-place techniques when they were utilized in the assembly of microLED display, including the most broadly recognized laser lift-off technique, contact µTP technique, laser non-contact µTP technique, and self-assembly technique. Herein, we firstly review the key developments in mass transfer technique and highlight their potential value, covering both the state-of-the-art devices and requirements for mass transfer in the assembly of the ultra-large-area display and virtual reality glasses. We begin with the significant challenges and the brief history of mass transfer technique, and expand that mass transfer technique is composed of two major techniques, namely, epitaxial Lift-off technique and pick-and-place technique. The basic concept and transfer effects for each representative epitaxial Lift-off and pick-and-place technique in mass transfer are then overviewed separately. Finally, the potential challenges and future research directions of mass transfer are discussed.

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Section: Magnetic/electric Fluid Self-assemblymentioning

confidence: 99%

Mass transfer techniques for large-scale and high-density microLED arrays

Chen

Bian

et al. 2022

Int. J. Extrem. Manuf.

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“…It employs a stochastic process, where a large number of device blocks are scattered in a fluid, so that all the recesses on the host substrate can capture a device block. The capturing force is, for example, gravity with van der Waals force, [1][2][3][4][5][6][7] electric force, [8][9][10][11][12] surface tension, [13][14][15][16][17][18][19] or magnetic force. 20) So far, various devices have been reported to be assembled using FSA, for example, LEDs, 1,4,8) laser diodes (LDs), 21) high-electron-mobility transistors (HEMTs), 22,23) and nanowires.…”

Section: Introductionmentioning

confidence: 99%

Fluidic Self-Assembly Using Molten Ga Bumps and Its Application to Resonant Tunneling Diodes

Nakano¹,

Shibata²,

Morita³

et al. 2013

Jpn. J. Appl. Phys.

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Fluidic self-assembly (FSA) using molten metal bumps is one of the most promising heterogeneous integration (HI) technologies, which enable us to integrate devices made of various materials on various substrates. We can fabricate the metal bumps using Ga having diameters of 24, 18, 12, and 8 µm with good yield. Using Ga has significant advantages; especially, it includes no toxic metals. These bumps were used for the FSA process of the metal dummy blocks having a diameter of 18 µm, and a good yield of 84% was obtained all over the substrate of about 1×1 cm2. Finally, we applied this method to the resonant tunneling diode (RTD) to verify good electrical, mechanical, and thermal contacts. The RTD device blocks having a diameter of 24 µm have been successfully assembled using the molten Ga bumps. This method is promising for high-performance RTD integration.

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“…For such connections, regions of heated liquefied solder act as binding sites to provide capillary forces for both mechanical and electrical connections. Examples of selfassembly followed by solder reflow include the use of electrostatic forces from electrified regions on a template, 12,13 gravitational forces to guide parts through an appropriately shaped hole, 14 and capillary forces from hexadecane droplets which form interfaces in an aqueous environment. 7,8 Alloys of different melting points 9 or locally heating different regions of the same alloy on a template 10 allow assembly to occur at selective binding sites.…”

Section: Introductionmentioning

confidence: 99%

Microscale self-assembly using molten alloys with different melting points

Morris

Dubey

2008

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Articles you may be interested inComparative study on size dependence of melting temperatures of pure metal and alloy nanoparticles Appl. Phys. Lett. 99, 013108 (2011);The authors demonstrate a system for self-assembling 280 m sized parts onto a separate template using two molten alloys having differing melting points. The use of two alloys decoupled the formation of mechanical and electrical connections and improved the resulting electrical contact resistance by over two orders of magnitude.

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Field-configured self-assembly: manufacturing at the mesoscale

Cited by 6 publications

References 5 publications

Mass transfer techniques for large-scale and high-density microLED arrays

Mass transfer techniques for large-scale and high-density microLED arrays

Fluidic Self-Assembly Using Molten Ga Bumps and Its Application to Resonant Tunneling Diodes

Microscale self-assembly using molten alloys with different melting points

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