Fiber-to-chip fusion splicing for low-loss photonic packaging

Nauriyal, Juniyali; Song, Meiting; Yu, R.; Cárdenas, Jaime

doi:10.1364/optica.6.000549

Cited by 35 publications

(6 citation statements)

References 52 publications

(46 reference statements)

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“…Due to the limitation of the low output power of the supercontinuum source (0 dBm at 40 MHz repetition rate) and high insertion loss of the grating coupler (>20 dB), the light with single-wavelength power lower than −33 dBm cannot be retrieved. The optical I/O configuration with higher coupling efficiency and broader bandwidth, such as edge coupler and 3D couplers, can be introduced to improve the weak light analytical capability. − In addition, the reconstruction error induced by the minor transmission peaks can be improved by the compensation algorithm (Supporting Information, Note 3).…”

Section: Device Characterizationmentioning

confidence: 99%

Broadband and High-Resolution Integrated Spectrometer Based on a Tunable FSR-Free Optical Filter Array

et al. 2022

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Integrated spectrometers provide the possibility of compact, low-cost portable spectroscopy sensing, which is the critical component of the lab-on-a-chip system. However, using existing on-chip designs is challenging to realize a high-resolution miniature spectrometer over a broad wavelength range. Here, we demonstrate an on-chip time-sampling narrowband filter array spectrometer that enables simultaneous acquisition of high-resolution spectra via optical Fabry−Peŕot cavities and a large spectral range with tunable free spectral range free filters. Two spectrometers consisting of five and seven filter cells with a compact footprint are fabricated and experimentally characterized, demonstrating a resolution of <0.43 and <0.51 nm and a spectral range of 73.2 and 102.7 nm, respectively. Unknown broad bandwidth input signal spectra can be successfully retrieved. Integrating more filter cells with thermal isolation trenches can dramatically boost the operational spectral range. Such spectrometers may open up new pathways toward spectral analytical applications.

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Section: Device Characterizationmentioning

confidence: 99%

Broadband and High-Resolution Integrated Spectrometer Based on a Tunable FSR-Free Optical Filter Array

et al. 2022

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“…The results of this process are challenging to correct; some recent work has demonstrated a new fusion technique to bond fibers to a PIC. 20 Guided modes coupled from the optical fiber interact with components placed down stream. Currently, no standardized method exists for evaluating individual component performance.…”

Section: Introductionmentioning

confidence: 99%

“…When attached using epoxy, the fiber can shift as the epoxy cures. The results of this process are challenging to correct; some recent work has demonstrated a new fusion technique to bond fibers to a PIC 20 . Guided modes coupled from the optical fiber interact with components placed down stream.…”

Section: Introductionmentioning

confidence: 99%

Engineered scattering elements used as optical test points in photonic integrated circuits

Howard,

Sukovaty,

Brown

2023

J. Optical Microsystems

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Efficient packaging of fabricated photonic integrated circuits (PICs) has been a daunting task given the breadth of applications and skill required for scalable manufacturing. One particular challenge has been accurately assessing the polarization state at various points in a PIC during the test, assembly, and packaging process. Polarimetric monitoring is necessary for optimizing fiber alignment, for verifying the quality of PIC components and for polarization-related functional testing. We analyze and demonstrate small-footprint engineered scattering elements for polarization monitoring. We find that small scatterers placed above or below a Si or SiN waveguide provide the best polarization integrity in a way that preserves foundry compatibility. The polarization response of these elements along with proper placement provides an optical test point that can be utilized for optimized fiber coupling into waveguides.

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“…In [9], 30 μm thick conductive glue was used to connect a MEMS structure directly to a printed circuit board. Different applications of packaging, such as fiber fixation with a chip, might be made using a thick glue instead of using fusion splicing based dedicated approach, as used in [10], but positioning accuracy then needs to be insured by some other flexible means.…”

Section: Introductionmentioning

confidence: 99%

High-Precision Gluing Tasks Based on Thick Films of Glue and a Microrobotics Approach

Tiwari

Clevy

Lutz

2019

IEEE Robot. Autom. Lett.

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Micro-assembly using glue is an industrial need, but at the microscale, the gluing process appears highly challenging. Especially when the thickness of the glue film is large relative to the size of components to be assembled. Moreover, the down-scaling of passive techniques used at the macroscale (such as using reference surfaces) are widespread, but require highly complex and dedicated procedures to reach the required precision (typically 1 µm or below). To address this, we propose an original approach for micro-assembly that consists of using a thick film of glue (glue thickness typically >50 µm) with an active microrobotic control. This approach enables us to have high precision positioning of the two components during the gluing task. The proposed approach appears highly versatile and flexible because it is independent of many parameters that usually influence gluing tasks. Several experiments without the use of the proposed approach show that the typical order of positional drift from curing could be of 5 to 15 µm. Finally, experimental results using the proposed approach demonstrate that a positioning accuracy of 200 nm can typically be obtained, which validates the approach and suggests its potential interest to industry.

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Fiber-to-chip fusion splicing for low-loss photonic packaging

Cited by 35 publications

References 52 publications

Broadband and High-Resolution Integrated Spectrometer Based on a Tunable FSR-Free Optical Filter Array

Broadband and High-Resolution Integrated Spectrometer Based on a Tunable FSR-Free Optical Filter Array

Engineered scattering elements used as optical test points in photonic integrated circuits

High-Precision Gluing Tasks Based on Thick Films of Glue and a Microrobotics Approach

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