Search citation statements
Paper Sections
Citation Types
Publication Types
Relationship
Authors
Journals
We discuss the role and the attributes of, as well as the state-of-the-art and some major findings in, the area of predictive analytical (“mathematical”) thermal stress modeling in electronic, opto-electronic, and photonic engineering. The emphasis is on packaging assemblies and structures and on simple meaningful practical models that can be (and actually have been) used in the mechanical (“physical”) design and reliability evaluations of electronic, opto-electronic, and photonic assemblies, structures, and systems. We indicate the role, objectives, attributes, merits, and shortcomings of analytical modeling and discuss its interaction with finite-element analysis (FEA) simulations and experimental techniques. Significant attention is devoted to the physics of the addressed problems and the rationale behind the described models. The addressed topics include (1) the pioneering Timoshenko’s analysis of bimetal thermostats and its extension for bimaterial assemblies of finite size and with consideration of the role of the bonding layer of finite compliance; this situation is typical for assemblies employed in electronics and photonics; (2) thermal stresses and strains in solder joints and interconnections; (3) attributes of the “global” and “local” thermal expansion (contraction) mismatch and the interaction of the induced stresses; (4) thermal stress in assemblies adhesively bonded at the ends and in assemblies (structural elements) with a low-modulus bonding layer at the ends (for lower interfacial stresses); (5) thin film systems; (6) thermal stress induced bow and bow-free assemblies subjected to the change in temperature; (7) predicted thermal stresses in, and the bow of, plastic packages of integrated circuit devices, with an emphasis on moisture-sensitive packages; (8) thermal stress in coated optical fibers and some other photonic structures; and (9) mechanical behavior of assemblies with thermally matched components (adherends). We formulate some general design recommendations for adhesively bonded or soldered assemblies subjected to thermal loading and indicate an incentive for a wider use of probabilistic methods in physical design for reliability of “high-technology” assemblies, including those subjected to thermal loading. Finally, we briefly address the role of thermal stress modeling in composite nanomaterials and nanostructures. It is concluded that analytical modeling should be used, whenever possible, along with computer-aided simulations (FEA) and accelerated life testing, in any significant engineering effort, when there is a need to analyze and design, in a fast, inexpensive, and insightful way, a viable, reliable, and cost-effective electronic, opto-electronic, or photonic assembly, package, or system.
We discuss the role and the attributes of, as well as the state-of-the-art and some major findings in, the area of predictive analytical (“mathematical”) thermal stress modeling in electronic, opto-electronic, and photonic engineering. The emphasis is on packaging assemblies and structures and on simple meaningful practical models that can be (and actually have been) used in the mechanical (“physical”) design and reliability evaluations of electronic, opto-electronic, and photonic assemblies, structures, and systems. We indicate the role, objectives, attributes, merits, and shortcomings of analytical modeling and discuss its interaction with finite-element analysis (FEA) simulations and experimental techniques. Significant attention is devoted to the physics of the addressed problems and the rationale behind the described models. The addressed topics include (1) the pioneering Timoshenko’s analysis of bimetal thermostats and its extension for bimaterial assemblies of finite size and with consideration of the role of the bonding layer of finite compliance; this situation is typical for assemblies employed in electronics and photonics; (2) thermal stresses and strains in solder joints and interconnections; (3) attributes of the “global” and “local” thermal expansion (contraction) mismatch and the interaction of the induced stresses; (4) thermal stress in assemblies adhesively bonded at the ends and in assemblies (structural elements) with a low-modulus bonding layer at the ends (for lower interfacial stresses); (5) thin film systems; (6) thermal stress induced bow and bow-free assemblies subjected to the change in temperature; (7) predicted thermal stresses in, and the bow of, plastic packages of integrated circuit devices, with an emphasis on moisture-sensitive packages; (8) thermal stress in coated optical fibers and some other photonic structures; and (9) mechanical behavior of assemblies with thermally matched components (adherends). We formulate some general design recommendations for adhesively bonded or soldered assemblies subjected to thermal loading and indicate an incentive for a wider use of probabilistic methods in physical design for reliability of “high-technology” assemblies, including those subjected to thermal loading. Finally, we briefly address the role of thermal stress modeling in composite nanomaterials and nanostructures. It is concluded that analytical modeling should be used, whenever possible, along with computer-aided simulations (FEA) and accelerated life testing, in any significant engineering effort, when there is a need to analyze and design, in a fast, inexpensive, and insightful way, a viable, reliable, and cost-effective electronic, opto-electronic, or photonic assembly, package, or system.
The review part of the paper addresses analytical modeling in fiber optics engineering. Attributes and significance of predictive modeling are indicated and discussed. The review is based mostly on the author's research conducted at during his tenure with Bell Labs for about twenty years, and, to a lesser extent, on his recent work in the field. The addressed topics include, but are not limited to, the following major fields: bare fibers; jacketed and dual-coated fibers; coated fibers experiencing thermal and/or mechanical loading; fibers soldered into ferrules or adhesively bonded into capillaries; roles of geometric and material non-linearity; dynamic response to shocks and vibrations; as well as possible applications of nanomaterials in new generations of coating and cladding systems. The extension part is concerned with a new, fruitful and challenging direction in optical engineering-probabilistic design for reliability (PDfR) of opto-electronic and photonic systems, including fiber optics engineering. The rationale behind the PDfR concept is that the difference between a highly reliable optical fiber system and an insufficiently reliable one is "merely" in the level of the never-zero probability of failure. It is the author's belief that when the operational reliability of an optical fiber system and product is imperative, the ability to predict, quantify, assure and, if possible and appropriate, even specify this reliability is highly desirable.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
customersupport@researchsolutions.com
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.