FIB‐fabricated complex‐shaped 3D chiral photonic silicon nanostructures

Rogov, Oleg Y.; Артемов, В. В.; Gorkunov, M. V.; Ezhov, A. A.; Хмеленин, Д. Н.

doi:10.1111/jmi.12644

Cited by 11 publications

(7 citation statements)

References 11 publications

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“…Although some early works suggested the possibility to restore the functionality of FIB-exposed silicon waveguides by annealing 19 , the particular prospects remained unexplored for a decade. Our recent electron microscopy studies have confirmed that FIB patterning of a SOS film generates a 50 nm thick damaged surface layer, which is also heavily contaminated with implanted gallium atoms 36 . Optical transmission measurements confirmed this layer to have an extremely adverse effect on the optical properties.…”

Section: Introductionmentioning

confidence: 56%

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Chiral visible light metasurface patterned in monocrystalline silicon by focused ion beam

Gorkunov

Rogov

Kondratov

et al. 2018

Sci Rep

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High refractive index makes silicon the optimal platform for dielectric metasurfaces capable of versatile control of light. Among various silicon modifications, its monocrystalline form has the weakest visible light absorption but requires a careful choice of the fabrication technique to avoid damage, contamination or amorphization. Presently prevailing chemical etching can shape thin silicon layers into two-dimensional patterns consisting of strips and posts with vertical walls and equal height. Here, the possibility to create silicon nanostructure of truly tree-dimensional shape by means of the focused ion beam lithography is explored, and a 300 nm thin film of monocrystalline epitaxial silicon on sapphire is patterned with a chiral nanoscale relief. It is demonstrated that exposing silicon to the ion beam causes a substantial drop of the visible transparency, which, however, is completely restored by annealing with oxidation of the damaged surface layer. As a result, the fabricated chiral metasurface combines high (50–80%) transmittance with the circular dichroism of up to 0.5 and the optical activity of up to 20° in the visible range. Being also remarkably durable, it possesses crystal-grade hardness, heat resistance up to 1000 °C and the inertness of glass.

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Section: Introductionmentioning

confidence: 56%

“…The optical studies of the fabricated metasurface presented below confirm this general rule. Our recent transmission electron microscopy studies 36 have revealed that processing with FIB gives rise to a 50 nm thick layer of damaged silicon, where the crystalline structure is altered and Ga atoms are implanted.…”

Section: Resultsmentioning

confidence: 99%

Chiral visible light metasurface patterned in monocrystalline silicon by focused ion beam

Gorkunov

Rogov

Kondratov

et al. 2018

Sci Rep

Self Cite

View full text Add to dashboard Cite

show abstract

“…As new nanotechnological approaches are being constantly introduced for the optical metasurface fabrication, the multitude of their designs steadily expands. For example, silicon nanostructures of truly threedimensional chiral shapes have been lately imprinted in monocrystalline silicon using digitally controlled focused ion beam [21]. The technique is capable of producing smooth complex shaped periodic corrugations of the silicon surface, and allowed creating highly transparent metasurfaces with strong optical chirality [22].…”

Section: Introductionmentioning

confidence: 99%

Corrugated silicon metasurface optimized within the Rayleigh hypothesis for anomalous refraction at large angles

Antonov

Gorkunov

2019

J. Opt. Soc. Am. B

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We optimize optical performance of metasurfaces based on periodically corrugated silicon layers by adjusting the Fourier coefficients of their surface profile. For smooth corrugations, we demonstrate an excellent quantitative accuracy of semi-analytical approach based on the Rayleigh hypothesis. We employ the approach to design metasurfaces with anomalous refraction due to dominant first order diffraction. Unlike conventional Huygens' dielectric metasurfaces, corrugated silicon layers are capable of efficient anomalous refraction in grazing directions: we obtain corrugation shapes allowing to deflect 70-80% of the energy of normally incident green light into the range of 68 • -85 • of angles with respect to the normal.

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“…Structured complex silicon components have the potential to develop breakthrough applications in solar cells, biomedical engineering, microfluidics, and MEMS for enhancing the functionality and performance of silicon components [1][2][3][4]. Traditionally, chemical-etching and focused ion beam are used to fabricate micro-nano structured silicon surfaces, but their low machining efficiency makes them unsuitable for complex structures with feature sizes in the range of hundreds of micrometres [5][6][7]. Some researchers have tried to machine structured surfaces using ultrashort pulsed lasers owing to the high material removal rate [8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Key machining characteristics in ultrasonic vibration cutting of single crystal silicon for micro grooves

2019

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Structured complex silicon components have the potential to develop breakthrough applications in solar cells, biomedical engineering, microfluidics, and MEMS. As silicon is a typical brittle material, ultrasonic vibration diamond cutting has been approved as a promising method to achieve better cutting performance compared to other conventional methods. However, few studies have been conducted on the cutting of structured silicon surfaces by applying high-frequency 1D ultrasonic vibration cutting (UVC), which is expected to possess higher material remove rate. Thus, a detailed understanding of the machining mechanism is yet to be developed. In this study, a series of tests that involve cutting grooves on the silicon surface were first performed by applying UVC and using a single crystal diamond tool. The machined surface and chips were subsequently measured and analysed to evaluate the critical undeformed chip thickness, surface finish, and chip formation. The critical undeformed chip thickness of silicon was found to reach 1030 nm under a certain vibration amplitude. An array of micro grooves was generated at the plastic region with a surface roughness Ra as low as 1.11 nm. Moreover, the material removal and chip formation mechanisms were discussed with the assistance of developing a model used for predicting the length of the tool vibration mark. The results revealed that the micro topography of continuous chips exhibited discontinuous clusters of lines with diameters of dozens of nanometres which was only composed of polysilicon. The model was proved to be able to predict tool marks with extremely low error. Thus, the impact of tool marks on the surface finish can be reduced and even eliminated with help of the model.

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FIB‐fabricated complex‐shaped 3D chiral photonic silicon nanostructures

Cited by 11 publications

References 11 publications

Chiral visible light metasurface patterned in monocrystalline silicon by focused ion beam

Chiral visible light metasurface patterned in monocrystalline silicon by focused ion beam

Corrugated silicon metasurface optimized within the Rayleigh hypothesis for anomalous refraction at large angles

Key machining characteristics in ultrasonic vibration cutting of single crystal silicon for micro grooves

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