FIB/DualBeam Techniques for Quantitative Analyses

Giannuzzi, L. A.

doi:10.1017/s1431927607074399

Cited by 1 publication

(1 citation statement)

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“…The ion‐induced SE emission varies profoundly with the crystallite orientation (Yahiro et al , 2004) resulting in high contrast ion channelling images, which reveal the microstructure of materials very well (Inkson, 2001; Bastos et al , 2006). The high contrast of ion channelling imaging is its main advantage over conventional SEM imaging (Giannuzzi, 2007). However, it is noted that ion–atom interactions during imaging may cause sputtering, grain growth, phase transformations, ion implantation, etc.…”

Section: Introductionmentioning

confidence: 99%

The complementary use of electron backscatter diffraction and ion channelling imaging for the characterization of nanotwins

Alimadadi

Fanta

Pantleon

2012

Journal of Microscopy

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SummaryOn the example of electrodeposited nickel films, it is shown that unique information on twins with dimensions on the nanoscale can be obtained by suitable combination of ion channelling imaging and electron backscatter diffraction analysis, whereas both (routine) single techniques cannot meet the requirements for analysis of these films. Highresolution electron backscatter diffraction is inadequate for full characterization of nanotwins, but image quality maps obtained from electron backscatter diffraction at least yield a qualitative estimation of the location and number of nanotwins. Complementing this information with ion channelling imaging provides more representative insights into the microstructure, because it supplements the quantitative investigation of the number and width of twin lamellae with additional crystallographic orientation analysis provided by EBSD. To this end, two methods for adjusting EBSD data based on ion channelling images are proposed. Thorough selection of the complementary techniques opens future perspectives for the investigation of other challenging samples with nanoscale features in the microstructure.

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