FEXT Reduction Using Mushroom Structures Thickened Soldermask for DDR5 PCBs

Yu, Xiaoling; Cai, Qiang‐Ming; Zhang, Liang; Zhang, Chao; Zhu, Lin; Ren, Yi; Fan, Jun

doi:10.1109/apcap50217.2020.9245950

2020 9th Asia-Pacific Conference on Antennas and Propagation (APCAP) 2020

DOI: 10.1109/apcap50217.2020.9245950

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FEXT Reduction Using Mushroom Structures Thickened Soldermask for DDR5 PCBs

Xiaoling Yu

Qiang‐Ming Cai

Liang Zhang

et al.

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FEXT Reduction Using Mushroom Structures Thickened Soldermask for DDR5 PCBs

Cited by 1 publication

References 7 publications

An Empirical Modeling of Far-End Crosstalk and Insertion Loss in Microstrip Lines

An Empirical Modeling of Far-End Crosstalk and Insertion Loss in Microstrip Lines

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