2012
DOI: 10.1088/0957-4484/23/21/215204
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Few electron limit of n-type metal oxide semiconductor single electron transistors

Abstract: Abstract. We report electronic transport on n-type silicon Single Electron Transistors (SETs) fabricated in Complementary Metal Oxide Semiconductor (CMOS) technology. The n-MOSSETs are built within a pre-industrial Fully Depleted Silicon On Insulator (FDSOI) technology with a silicon thickness down to 10 nm on 200 mm wafers. The nominal channel size of 20×20 nm 2 is obtained by employing electron beam lithography for active and gate levels patterning. The Coulomb blockade stability diagram is precisely resolve… Show more

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Cited by 52 publications
(47 citation statements)
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“…The simulated device, presented in Fig.4, features realistic geometric sizes closer to the device (single and double quantum dots) proposed in Refs. [26,27]. The device considered is a silicon nanowire featuring a rectangular section with a fixed thickness T Si =15 nm and with a width W .…”
Section: Gate Design and Performancesmentioning
confidence: 99%
“…The simulated device, presented in Fig.4, features realistic geometric sizes closer to the device (single and double quantum dots) proposed in Refs. [26,27]. The device considered is a silicon nanowire featuring a rectangular section with a fixed thickness T Si =15 nm and with a width W .…”
Section: Gate Design and Performancesmentioning
confidence: 99%
“…b) Electronic mail: e.charbon@tudelft.nl fabricated in a deep-submicron (DSM) CMOS process, due to its density, versatility, and full compatibility with standard CMOS circuits. DSM CMOS circuits have been known to operate at deep cryogenic temperatures, down to several hundreds of mK [16][17][18][19]21,22 . Cryogenic FPGAs can operate at 4K as a quantum controller 23,24 .…”
Section: Introductionmentioning
confidence: 99%
“…[3] The study of the Anderson-Mott transition from delocalized to localized electrons in semiconductors triggered by the doping concentration is a metal-insulator transition (MIT) [4,5,6,7]. Such MIT has represented a hard problem to solve theoretically and experimentally, even in the case of the most simple and well known case of doped silicon such as Si:As and Si:P. [7] The possibilities opened by nanofabrication of semiconductor devices [8,9] consist in the control of the position of impurity atoms at nanometric precision by a one-by-one method of implantation called single ion implantation (SII). Taking advantage of this method [10,11,12], it has been possible to create chains of individually implanted ions in silicon [13,14], and to investigate the effects caused by their proximity and the residual disorder affecting their position and ground state energy distribution [15].…”
Section: Introductionmentioning
confidence: 99%