2014 IEEE 6th International Memory Workshop (IMW) 2014
DOI: 10.1109/imw.2014.6849367
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Ferroelectric deep trench capacitors based on Al:HfO2 for 3D nonvolatile memory applications

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Cited by 94 publications
(87 citation statements)
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“…Titanium nitride was used as top and bottom electrode to form metal ferroelectric metal (MFM) capacitors. The bottom electrodes were deposited by thermal ALD using TiCl 4 and NH 3 at 450 • C using an ASM A412 batch furnace. The top electrode for planar 2D samples was deposited by sputtering TiN thin films to minimize the thermal stress for the ferroelectric.…”
Section: Experimental Methodsmentioning
confidence: 99%
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“…Titanium nitride was used as top and bottom electrode to form metal ferroelectric metal (MFM) capacitors. The bottom electrodes were deposited by thermal ALD using TiCl 4 and NH 3 at 450 • C using an ASM A412 batch furnace. The top electrode for planar 2D samples was deposited by sputtering TiN thin films to minimize the thermal stress for the ferroelectric.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…Samples for electrical characterization were prepared by e-beam evaporating metal dots (5nm Ti glue layer/20nm Pt electrode) on top of the TiN top electrode via a shadow mask. The TiN top electrode was etched using these metal dots as masking layer by an SC1 (NH 4 were prepared using a process flow described in detail elsewhere. 4 This process flow uses TiN top electrodes deposited by pulsed CVD at 400 • C. The 3D samples were also annealed at 650 • C for 20s to guarantee the formation of a crystalline phase.…”
Section: Experimental Methodsmentioning
confidence: 99%
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“…9,10 In recent years ferroelectric capacitors with Al-doped HfO 2 films have also been studied. 11,12 Some quantitative studies of 3D ferroelectric capacitors on trench holes with PZT films were shown in Reference 4 and 5. The sidewalls of narrower trench holes seemed to have lower effective contribution to remnant polarization.…”
Section: Introductionmentioning
confidence: 99%