A microfabrication process for poly(vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)) based flexible piezoelectric devices is proposed using heat controlled spin coating and reactive ion etching (RIE) techniques. Dry etching of P(VDF-TrFE) in CF 4 +O 2 plasma is found to be more effective than that using SF 6 +O 2 or Ar+O 2 feed gas with the same radiofrequency power and pressure conditions. A maximum etching rate of 400 nm/min is obtained using the CF 4 +O 2 plasma with an oxygen concentration of 60% at , and heart beat sensors [7]. Cantilever shaped P(VDF-TrFE) actuators were also fabricated for mini-robots application, in which a multilayered P(VDF-TrFE) structure was proposed to achieve a large displacement with a low driving voltage [8]. Most of the PVDF based devices were fabricated using commercial PVDF films and traditional fabrication techniques such as scissoring, laser machining, and lamination [9,10]. With the aim of integrating piezoelectric polymers into microdevices, ionized evaporation, electrospray, electrospun, Langmuir-Blodgett deposition, and heat controlled spin coating methods were developed. Ionized evaporation and electrospray processes were reported to deposit PVDF films for pyroelectric infrared sensors in 1990s [11,12]. An electrospun method was employed to fabricate PVDF nanofibers for sensors and energy harvesters [5,13]. For fabrication of nonvolatile memory devices, low-temperature fabrication approaches including Langmuir-Blodgett deposition [14,15] and spin coating methods [16] were developed. The spin coated P(VDF-TrFE) films, intrinsically tending to form phase I crystal with a high remanent polarization, are