2019
DOI: 10.1016/j.apsusc.2019.03.296
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Femtosecond laser micromachining of co-polymeric urethane materials

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Cited by 13 publications
(10 citation statements)
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References 52 publications
(76 reference statements)
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“…In the previous studies, the most widely studied polymeric substrates were polymethylmethacrylate (PMMA), polyethylene (PE), polycarbonate (PC), polyfluoroethylene, and polyimide (PI) [39]. The contribution of the incubation effect to ablation was observed in the femtosecondlaser treatment of some polymers.…”
Section: Ablation Thresholdmentioning
confidence: 99%
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“…In the previous studies, the most widely studied polymeric substrates were polymethylmethacrylate (PMMA), polyethylene (PE), polycarbonate (PC), polyfluoroethylene, and polyimide (PI) [39]. The contribution of the incubation effect to ablation was observed in the femtosecondlaser treatment of some polymers.…”
Section: Ablation Thresholdmentioning
confidence: 99%
“…In the micromachining of polymer substrates using femtosecond lasers, a comparison of the behaviour of urethane-based amorphous co-polymers to similar homopolymers was conducted [39]. Scanning electron microscopy (SEM) images revealed the presence of pores in the microstructure produced by ablation using a 275 nm wavelength femtosecond laser beam.…”
Section: Ablation Thresholdmentioning
confidence: 99%
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“…32,33 While traditional photolithography has been applied to polymeric resins, 34 hyperbolic metamaterials, 35 nanostructures, 36 photonic crystals 37 and cocrystal thin films, 38 the ability to accurately shape, or machine, organic crystalline solids using low-powered visible or ultraviolet (UV) light has yet to be achieved. While machining of patterns has been reported using high-energy beam techniques, such as focused ion beam (FIB) milling, 39 electron beam lithography, or femtosecond laser beam machining, 40 these methods operate at high energies (1-50 keV) and beam powers (on the order of several Watts) that produce chemical damage to organic materials, and are most commonly used for organic polymers and inorganic materials. [41][42][43][44] Here we describe cocrystallization through halogen bonding as a route to obtain crystalline organic materials that can be engraved, cut, and/or punctured without chemical damage, with micrometer-scale precision, using a laser beam with output powers in the milliwatt range (0.5-20 mW), i.e.…”
mentioning
confidence: 99%
“…32,33 While traditional photolithography has been applied to polymeric resins, 34 hyperbolic metamaterials, 35 nanostructures, 36 photonic crystals 37 and cocrystal thin films, 38 the ability to accurately shape, or machine, organic crystalline solids using low-powered visible or ultraviolet (UV) light has yet to be achieved. While machining of patterns has been reported using high-energy beam techniques, such as focused ion beam (FIB) milling, 39 electron beam lithography, or femtosecond laser beam machining, 40 these methods operate at high energies (1-50 keV) and beam powers (on the order of several Watts) that produce chemical damage to organic materials, and are most commonly used for organic polymers and inorganic materials. [41][42][43][44] Here we describe cocrystallization through halogen bonding as a route to obtain crystalline organic materials that can be engraved, cut, and/or punctured without chemical damage, with micrometer-scale precision, using a laser beam with output powers in the milliwatt range (0.5-20 mW), i.e.…”
mentioning
confidence: 99%