2017
DOI: 10.1039/c7nr04377e
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Femtosecond laser ablation of transparent microphotonic devices and computer-generated holograms

Abstract: Femtosecond laser ablation allows direct patterning of engineering materials in industrial settings without requiring multistage processes such as photolithography or electron beam lithography. However, femtosecond lasers have not been widely used to construct volumetric microphotonic devices and holograms with high reliability and cost efficiency. Here, a direct femtosecond laser writing process is developed to rapidly produce transmission 1D/2D gratings, Fresnel Zone Plate lenses, and computer-generated holo… Show more

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Cited by 20 publications
(25 citation statements)
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“…The presented technique provides a fast and economically viable approach for fabricating glass optical diffusers compare to femtosecond laser. 33,54 A numerical model was developed to simulate the laser ablation process on the soda-lime glass substrates. This study examines the effect of implementing different surface relief microstructures and increasing the diffusing surfaces on the optical performance.…”
Section: Introductionmentioning
confidence: 99%
“…The presented technique provides a fast and economically viable approach for fabricating glass optical diffusers compare to femtosecond laser. 33,54 A numerical model was developed to simulate the laser ablation process on the soda-lime glass substrates. This study examines the effect of implementing different surface relief microstructures and increasing the diffusing surfaces on the optical performance.…”
Section: Introductionmentioning
confidence: 99%
“…[12] Among the techniques available for fabrication of microreactors with serpentine channels and T-junctions, femtosecond laser ablation has been drawing attention because it allows machining of a variety of materials, including metals, glass, and ceramics. [14][15][16][17][18] Mechanical micromachining and electric discharge machining wear out the equipment used in the process, while a focused ion beam machining is performed under vacuum; such techniques also require small etching velocities, not allowing fast prototyping. [19] Lithography methods and deep reactive ion etching were adapted from the microelectro-mechanical-systems (MEMS) manufacturing, but are still expensive and complex to operate.…”
Section: Introductionmentioning
confidence: 99%
“…[19] Lithography methods and deep reactive ion etching were adapted from the microelectro-mechanical-systems (MEMS) manufacturing, but are still expensive and complex to operate. [12,16] Laser methods based on direct ablation etch materials by a heating mechanism that affects the surroundings of the focused area by heat diffusion, damaging material properties due to phase transition. [19] Femtosecond laser ablation uses high intensity beams combined with short exposure time ($10 À15 s).…”
Section: Introductionmentioning
confidence: 99%
“…In particular, the progress of short pulse lasers enables the fine processing of metals [1,2], ceramics [3,4], semiconductors [5,6], and composites [7,8] with minimal heat affected zone (HAZ) and less debris around laser-irradiated areas. Transparent materials without absorption at the wavelength of the incident laser can also be processed through multiphoton absorption due to high peak power at the focal spot [9][10][11].…”
Section: Introductionmentioning
confidence: 99%