FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint

Chenniki, Walide; Bord‐Majek, Isabelle; Lévrier, Bruno; Wongtimnoi, Komkrisd; Diot, Jean-Luc; Ousten, Yves

doi:10.1109/eurosime.2014.6813805

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and 2014

DOI: 10.1109/eurosime.2014.6813805

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FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint

Walide Chenniki

Isabelle Bord‐Majek

Bruno Lévrier

et al.

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FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint

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