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Proceedings of the International Conference on Communication and Signal Processing 2016 (ICCASP 2016) 2017
DOI: 10.2991/iccasp-16.2017.30
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FEM Simulation and Analysis of Temperature Field of Environmental Friendly MQL Grinding

Abstract: Abstract:This study proposes an approach for the development of a three dimensional transient heat conduction finite element model (FEM) for grinding process. FEM simulates the temperature field in conventional and nanofluid based environmental friendly minimum quantity lubrication (MQL) grinding process. For this FEM simulation the boundary conditions were obtained on the basis of results of the heat transfer on semi-infinite object with a heat source moving along its surface. Instrumented surface grinding ma… Show more

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Cited by 4 publications
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