2006
DOI: 10.1557/proc-0914-f09-23
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Feasibility Study for Usage of Diluted Fluorine for Chamber Clean Etch Applications as an Environmental Friendly Replacement of NF3

Abstract: Deposition steps in CVD and ALD applications usually not only cover the surface of the substrate surface but also the walls of the chamber inside. Regular removal of those residuals has to be done to obtain stable and repeatable deposition results with uniform surfaces at acceptable particle levels. The high requirements to sustain stable processes has lead to more frequent chamber cleans. NF3 has emerged as the main clean gas for remote clean applications. While it meets the above mentioned requirements and i… Show more

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Cited by 2 publications
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“…Regular removal of those residuals has to be done to obtain stable and repeatable deposition results with uniform surfaces at acceptable particle levels [1] . Since long time, chamber cleaning gases like Tetrafluoromethane (CF 4 ) and Hexafluoroethane (C 2 F 6 ) are used [2,3,4] .…”
Section: Introductionmentioning
confidence: 99%
“…Regular removal of those residuals has to be done to obtain stable and repeatable deposition results with uniform surfaces at acceptable particle levels [1] . Since long time, chamber cleaning gases like Tetrafluoromethane (CF 4 ) and Hexafluoroethane (C 2 F 6 ) are used [2,3,4] .…”
Section: Introductionmentioning
confidence: 99%
“…Studies have been conducted to replace NF 3 [16,17]. Among them, F 3 NO was considered a candidate gas to replace NF 3 [18].…”
Section: Introductionmentioning
confidence: 99%