Feasibility Investigations on Selective Laser Melting for the Development of Microchannel Cooling in Power Electronics

Syed-Khaja, Aarief; Freire, Antonio Perinan; Kaestle, Christopher; Franke, Jöerg

doi:10.1109/ectc.2017.232

Cited by 8 publications

(3 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In the field of electronics, optimized components can be realized with AM to meet the demand for smaller but more powerful devices [7]. For example, optimized heat sinks with a high surface-to-volume ration [8] or integrated cooling channels [9] can be manufactured using AM leading to improved heat dissipation, which increases the efficiency and longevity of those components. In addition, AM can be used to optimize and custom-design other components in power electronics, such as busbars or power rails.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating

Hecht,

Ockel,

Stoll

et al. 2024

Laser 3D Manufacturing XI

View full text Add to dashboard Cite

With the increasing demand for customized products, new requirements on production processes are set. Additive manufacturing with its tool-independent character shows great potential to replace conventional manufacturing processes. This also applies to power electronic assemblies, which are currently produced with a low variety of variants in large batches. However, high-quality processing of copper is a prerequisite for power electronics applications in order to achieve low power losses and long module lifetimes. Green high-power lasers show great potential to process pure copper powder by means of powder bed fusion using a laser-based system (PBF-LB/M) and open up new opportunities in power electronics production. PBF-LB/M not only facilitates the production of mono-material components such as load connectors or heat sinks but also provides multi-material capabilities, enabling 3D metallizations on ceramic substrates for use as power electronic circuit carriers. Therefore, parametric studies on the fabrication of copper metallizations via PBF-LB/M on alumina substrates using a 1 kW green laser have been conducted and are summarized in this paper. At first, the beam-matter interaction between preheated alumina substrates and parameterized laser radiation was analyzed. Based on the results, process parameters have been defined, which were then used for the production of copper metallizations. High temperature preheating of the ceramics was applied in order avoid delamination effects due to thermomechanical stresses during solidification. In parametric studies with respect to laser power, laser velocity and hatching distance on 500 °C preheated substrates, electrical conductivities of 30 MS/m and shear strengths of 69 MPa were obtained.

show abstract

Section: Introductionmentioning

confidence: 99%

Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating

Hecht,

Ockel,

Stoll

et al. 2024

Laser 3D Manufacturing XI

View full text Add to dashboard Cite

show abstract

“…The toughness of the heat sink produced with the additive manufacturing aluminium alloy was similar to the strength of the heat sink produced by conventional methods, but the thermal performance was lower for lower temperatures. Later, Syed-Khaja et al [ 14 ] used PBF to fabricate a heat sink design that showed key enabling advantages such as the reduction in volume, weight, and chip temperatures. To date, several other studies have emerged regarding heat sinks produced by additive manufacturing [ 5 , 15 , 16 , 17 , 18 , 19 , 20 ].…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Active Heat Sinks Design under Forced Convection—Effect of Geometric and Boundary Parameters

2021

View full text Add to dashboard Cite

This study shows the performance of heat sinks (HS) with different designs under forced convection, varying geometric and boundary parameters, via computational fluid dynamics simulations. Initially, a complete and detailed analysis of the thermal performance of various conventional HS designs was taken. Afterwards, HS designs were modified following some additive manufacturing approaches. The HS performance was compared by measuring their temperatures and pressure drop after 15 s. Smaller diameters/thicknesses and larger fins/pins spacing provided better results. For fins HS, the use of radial fins, with an inverted trapezoidal shape and with larger holes was advantageous. Regarding pins HS, the best option contemplated circular pins in combination with frontal holes in their structure. Additionally, lattice HS, only possible to be produced by additive manufacturing, was also studied. Lower temperatures were obtained with a hexagon unit cell. Lastly, a comparison between the best HS in each category showed a lower thermal resistance for lattice HS. Despite the increase of at least 38% in pressure drop, a consequence of its frontal area, the temperature was 26% and 56% lower when compared to conventional pins and fins HS, respectively, and 9% and 28% lower when compared to the best pins and best fins of this study.

show abstract

“…Recently, additive manufacturing has shown to be a growing area of research to achieve optimized high-performance heat sink designs that cannot be achieved using traditional manufacturing techniques [18]- [20]. In order to leverage additive manufacturing technologies and overcome the aforementioned limitations related to the use of TIM or the use of direct cooling technologies, a new approach is proposed and evaluated in this article.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Direct Printed Heat Sinks on Metallized Ceramic Substrate for High-Performance Power Modules

Khazaka

Martín

Alexis

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

View full text Add to dashboard Cite

In this article, we propose a new packaging technology enabling the development of a high-performance power module for harsh environments. This approach is based on the use of the selective laser melting (SLM) technique in order to directly print metal heat sinks on the backside of the metallized substrate. In order to explore the viability of this method, the assembled parts were evaluated thoroughly after the manufacturing process. Moreover, their robustness was assessed during aging under harsh conditions. Results show that the ultimate tensile strength and yield strength of the printed alloy are higher than the casted AlSi 7 Mg 0.6 counterpart. The interfaces between the printed alloy and the substrate Al metal layer do not show any weaknesses, and shear stress values are higher than 100 MPa. For all heat sink patterns, the substrate warpage is reduced during thermal cycling due to the Al alloy creeping, while the highly curved substrates show cracks in the ceramic after 400 cycles. Accordingly, direct printing of heat sink with patterns based on fins array reveals a promising path for highreliability, high-performance power module packaging.

show abstract

Feasibility Investigations on Selective Laser Melting for the Development of Microchannel Cooling in Power Electronics

Cited by 8 publications

References 11 publications

Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating

Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating

Evaluation of Active Heat Sinks Design under Forced Convection—Effect of Geometric and Boundary Parameters

Evaluation of Direct Printed Heat Sinks on Metallized Ceramic Substrate for High-Performance Power Modules

Contact Info

Product

Resources

About