FEA technique of hot plate forming process using cell-typed die with cooling device

Determination of the Interfacial Heat Transfer Coefficient in the Hot Stamping of AA7075

“…The IHTC increased from 4 to 6.3 kW/m 2 K as the contact pressure increased from 8 to 42 MPa. A similar linear increase of the IHTC with pressure was also obtained in the hot stamping of 22MnB5 [1] steel and hot forming of AA5083 [10].…”

“…Once the target temperature was reached, the workpiece was compressed between the dies to a target pressure while the temperatures measured using thermocouples embedded in the workpiece were recorded to obtain the temperature evolutions. Some researchers [7][8][9][10] calculated IHTC values using similar methods by clamping the workpiece between two dies and measuring the temperature history of the workpiece as well. Alternatively, some other researchers [11][12][13] measured the die temperature, instead of the workpiece temperature, to obtain IHTC values.…”

Determination of the interfacial heat transfer coefficient in the hot stamping of AA7075

“…Once the target temperature was reached, the workpiece was compressed between the dies to a target pressure while the temperatures measured using thermocouples embedded in the workpiece were recorded to obtain the temperature evolutions. Some researchers [7][8][9][10] calculated IHTC values using similar methods by clamping the workpiece between two dies and measuring the temperature history of the workpiece as well. Alternatively, some other researchers [11][12][13] [14] experiments, specimens were heated to target temperatures of 820, 930, 1030 or 1180…”