FE-I2: a front-end readout chip designed in a commercial 0.25-/spl mu/m process for the ATLAS pixel detector at LHC

Blanquart, L.; Richardson, J. D.; Einsweiler, K.; Fischer, P.; Mandelli, E.; Meddeler, G.; Perić, I.

doi:10.1109/tns.2004.832895

Cited by 26 publications

(21 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…A Pixel module [13,14] consists of a single silicon wafer with an array of 50×400 µm 2 pixels that are read out by 16 chips [15]. The active area of each module is ∼ 60.8 × 16.4 mm 2 .…”

Section: Setup Data Samples and Trackingmentioning

confidence: 99%

Alignment of the Pixel and SCT Modules for the 2004 ATLAS Combined Test Beam

et al. 2008

View full text Add to dashboard Cite

A small set of final prototypes of the ATLAS Inner Detector silicon tracking system (Pixel Detector and SemiConductor Tracker), were used to take data during the 2004 Combined Test Beam. Data were collected from runs with beams of different flavour (electrons, pions, muons and photons) with a momentum range of 2 to 180 GeV/c. Four independent methods were used to align the silicon modules. The corrections obtained were validated using the known momenta of the beam particles and were shown to yield consistent results among the different alignment approaches. From the residual distributions, it is concluded that the precision attained in the alignment of the silicon modules is of the order of 5 µm in their most precise coordinate.

show abstract

Section: Setup Data Samples and Trackingmentioning

confidence: 99%

Alignment of the Pixel and SCT Modules for the 2004 ATLAS Combined Test Beam

et al. 2008

View full text Add to dashboard Cite

show abstract

“…The challenge in the design of the front-end pixel electronics [13] can be summarized by the following requirements: low power (< 50µW per pixel), low noise and threshold dispersion (together < 200e), zero suppression in every pixel, on-chip hit buffering, and small time-walk to be able to assign the hits to their respective LHC bunch crossing. The pixel groups at the LHC have reached these goals in several design iterations using first radiation-soft prototypes, then dedicated radhard designs, and finally using deep submicron technologies.…”

Section: Radiation Hard Hybrid Pixel Detectors For the Lhcmentioning

confidence: 99%

Pixel detectors for tracking and their spin-off in imaging applications

Wermes

2005

Nuclear Instruments and Methods in Physics Research Section A:

View full text Add to dashboard Cite

To detect tracks of charged particles close to the interaction point in high energy physics experiments of the next generation colliders, hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the present state of the art in detector technology. Three of the LHC detectors as well as the BTeV detector at the Tevatron will use vertex detectors based on this technology. A development period of almost 10 years has resulted in pixel detector modules which can stand the extreme rate and timing requirements as well as the very harsh radiation environment at the LHC for its full life time and without severe compromises in performance. From these developments a number of different applications have spun off, most notably for biomedical imaging. Beyond hybrid pixels, a number of trends and possibilities with yet improved performance in some aspects have appeared and presently developed to greater maturity. Among them are monolithic or semi-monolithic pixel detectors which do not require complicated hybridization but come as single sensor/IC entities. The present state in hybrid pixel detector development for the LHC experiments as well as for some imaging applications is reviewed and new trends towards monolithic or semi-monolithic pixel devices are summarized.

show abstract

“…Their design was similar to that of the final front-end electronics for ATLAS Pixel [14,15]. In each front-end chip, 2880 channels are arranged into 18 columns by 160 rows.…”

Section: Front-end Electronicsmentioning

confidence: 99%

Characterization and modeling of non-uniform charge collection in CVD diamond pixel detectors

Lari

Wermes

et al. 2005

Nuclear Instruments and Methods in Physics Research Section A:

View full text Add to dashboard Cite

A pixel detector with a CVD diamond sensor has been studied in a 180 GeV/c pion beam. The charge collection properties of the diamond sensor were studied as a function of the track position, which was measured with a silicon microstrip telescope. Non-uniformities were observed on a length scale comparable to the diamond crystallites size. In some regions of the sensor, the charge drift appears to have a component parallel to the sensor surface (i.e., normal to the applied electric field) resulting in systematic residuals between the track position and the hits position as large as 40 µm. A numerical simulation of the charge drift in polycrystalline diamond was developed to compute the signal induced on the electrodes by the electrons and holes released by the passing particles. The simulation takes into account the crystallite structure, non-uniform trapping across the sensor, diffusion and polarization effects. It is in qualitative agreement with the data. Additional lateral electric field components result from the non-uniform trapping of charges in the bulk. These provide a good explanation for the large residuals observed.

show abstract

FE-I2: a front-end readout chip designed in a commercial 0.25-/spl mu/m process for the ATLAS pixel detector at LHC

Cited by 26 publications

References 7 publications

Alignment of the Pixel and SCT Modules for the 2004 ATLAS Combined Test Beam

Alignment of the Pixel and SCT Modules for the 2004 ATLAS Combined Test Beam

Pixel detectors for tracking and their spin-off in imaging applications

Characterization and modeling of non-uniform charge collection in CVD diamond pixel detectors

Contact Info

Product

Resources

About