In this paper, we present a comprehensive study for analyzing data transmission quality along interconnections taking into account microstrip discontinuities, internal noise sources within active terminations such as Complementary Metal Oxide Semiconductor (CMOS) circuits, and crosstalk. The proposed method consists in combining the Finite Difference Time Domain (FDTD) algorithm to solve Multiconductor Transmission Lines (MTL) equations and the Modified Nodal Analysis (MNA) formulation to include network models of discontinuities, along with the technique of setting eye diagrams. The comparison with Advanced Design System (ADS) software validates the whole simulation process. Several configurations related to bendy interconnections loaded with noisy CMOS circuits have been dealt with. The outcome turned out very useful and can provide valuable information on signal integrity within the sampling context.