Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density

Lee, J.H.; Jeong, Hyun-Yong

doi:10.1016/j.ijfatigue.2013.10.021

Cited by 33 publications

(16 citation statements)

References 9 publications

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“…Fatigue life of the ball grid array (BGA) solders in the electronic kit under dynamic and vibration loads has been examined in Cinar and Jang (2014) and a high-low scale modeling was used to determine the stress intensity of the solder joints. A new fatigue equation with vibration frequency and cracking energy density considerations was proposed by Lee and Jeong (2014) for solder joints. S-N curve dependency of packaging architecture and arrangement was discovered and numerated by Xia et al (2017b) and supported with three-dimensional FEM simulations of micro-scale chip scale package under cyclic mechanical loadings (Han et al, 2017).…”

Section: Introductionmentioning

confidence: 99%

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

Gao

Wang

Ding

et al. 2020

SSMT

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Section: Introductionmentioning

confidence: 99%

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

Gao

Wang

Ding

et al. 2020

SSMT

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“…For example, the Coffin-Manson model [11] assumes a linear relationship between the plastic strain amplitude and fatigue life in the logarithmic coordinate and the Morrow model [12] relates a plastic strain energy density and fatigue life in the logarithmic coordinate. Subsequently, the strain rate effect on fatigue life was incorporated by developing the frequency-modified parameters in the frequency-modified Coffin-Manson model [13] and the frequency-modified energy model [14], respectively. The Coffin-Manson model and the Morrow energy model can predict well under the isothermal conditions, but they cannot explain the effect of strain rate on fatigue life.…”

Section: Introductionmentioning

confidence: 99%

“…They only represent how the material constants change with respect to the test temperatures. Therefore, it is better to improve and modify the existing models, including the Coffin-Manson model and the Morrow model mentioned above [11,12,13,14], to account for the temperature dependency of fatigue life.…”

Section: Introductionmentioning

confidence: 99%

An Energy-Based Unified Approach to Predict the Low-Cycle Fatigue Life of Type 316L Stainless Steel under Various Temperatures and Strain-Rates

2019

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An energy-based low-cycle fatigue model was proposed for applications at a range of temperatures. An existing model was extended to the integrated approach, incorporating the simultaneous effects of strain rate and temperature. A favored material at high temperature, type 316L stainless steel, was selected in this study and its material characteristics were investigated. Tensile tests and low-cycle fatigue tests were performed using several strain rates at a temperature ranging from room temperature to 650 °C. Material properties were obtained in terms of temperature using the displacement-controlled tensile tests and further material response were investigated using strain-controlled tensile tests. Consequently, no pronounced reduction in strengths occurred at temperatures between 300 and 550 °C, and a negative strain rate response was observed in the temperature range. Based on the low-cycle fatigue tests by varying strain rates and temperature, it was found that a normalized plastic strain energy density and a strain-rate modified cycle were successfully correlated. The accuracy of the model was discussed by comparing between predicted and experimental lives.

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“…Previously, IMCs were concentrated at the interface between the pad and the solder material [1][2][3][4][5]. The brittle property of IMCs was reported to cause a strong stress concentration effect during mechanical impacts [6][7][8][9][10]. In remark, the presence of IMC has greatly influenced the reliability of solder joints.…”

Section: Introductionmentioning

confidence: 99%

Finite element modelling of thin intermetallic compound layer fractures

Pang¹,

Daud²,

Amin³

et al. 2017

J. MECH. ENG. SCI.

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A thin intermetallic compound (IMC) of solder ball joint induces strong stress concentration between the pad and solder where a crack propagated near the IMC layer. The fracture mechanism of the IMC layer is complex due to the effect of IMC thickness, crack length, solder thickness and Young's Modulus. At present, there is still an undefined exact geometrical model correlation for numerical simulations of IMC layer fracture. Thus, this paper aims to determine the accuracy of IMC layer models subjected to crack-to-width length ratio (a/W) in correlation with the ASTM E399-83 Srawley compact specimen model using finite element (FE) analysis. Several FE models with different geometrical configurations have been proposed under 10 MPa tensile loading. In this study, the two dimensional linear elastic displacement extrapolation method (DEM) is formulated to calculate the stress intensity factor (SIF) at the crack tip. The study showed that with an error of 0.58% to 0.59%, a width of 2.1 mm and a height of 1.47 mm can be recommended as the best geometrical model for IMC layer fracture modelling which provides a wider range for a/W from 0.45 to 0.85 instead of from 0.45 to 0.55. This result is significant as it presents a method for determining fracture parameters at thin IMC layers with a combination of singular elements with meshes at different densities which is tailored to the Srawley model.

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Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density

Cited by 33 publications

References 9 publications

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

An Energy-Based Unified Approach to Predict the Low-Cycle Fatigue Life of Type 316L Stainless Steel under Various Temperatures and Strain-Rates

Finite element modelling of thin intermetallic compound layer fractures

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