Fatigue life estimations of solid-state drives with dummy solder balls under vibration

Jang, Jae-Hyung; Jang, Gunhee; Lee, Juyub; Cho, Yeungjung; Cinar, Yusuf

doi:10.1016/j.ijfatigue.2016.03.016

Cited by 24 publications

(13 citation statements)

References 13 publications

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“…So, this might be the reason that consumers are less willing to pay for a remanufactured product than a new one (Guide Jr and Li 2010). In addition to the above-mentioned deterrents to the reuse of HDDs, they are now being superseded by solid state drives (SSDs), leading to a lower demand for HDDs (Jang et al 2016). Finally, the shift to using cloud computing decreases the purchase of information technologies (IT) equipment at the individual consumer level (Amankwah-Amoah 2016b).…”

Section: Value Leakage Due To the Lack Of On-time Reusementioning

confidence: 99%

The Global Flow of Hard Disk Drives: Quantifying the Concept of Value Leakage in E‐waste Recovery Systems

Sabbaghi

Cade²,

Olson

et al. 2018

J of Industrial Ecology

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Summary The remaining value within end‐of‐use/life hard disk drives (EoU/L HDDs) is often not optimally recovered. The improper collection and recovery of HDDs contribute not only to rising environmental and social concerns worldwide, but also to the transformation of the economy and a significant loss of value. Currently, the most preferred treatment option for used hard drives is to recover the metals with the highest recycling effectiveness, such as steel and aluminum, via a shredding‐based recycling process that results in both value and material leakages. The complexity of retrieving the remaining values within EoU/L HDDs demands a larger view of the global supply of HDDs available for recovery. The aim of this paper is to first identify the geographical patterns of transboundary global shipments of new and used HDDs between developing and developed regions, and then capture and quantify the value leakage by bringing several unique perspectives. Two analyses have been conducted. First, the loss of value due to the insufficient recovery of neodymium (Nd) at the global level is quantified. Second, the value leakage as a result of the delay on on‐time reuse of HDDs is captured. Furthermore, the central challenges toward proper recovery of HDDs, where consumer electronic industry can make significant contributions, have been identified. HDDs are well positioned to contribute important insights to the recovery of other electronic devices, so the findings from HDDs can be adopted for other types of electronics.

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Section: Value Leakage Due To the Lack Of On-time Reusementioning

confidence: 99%

The Global Flow of Hard Disk Drives: Quantifying the Concept of Value Leakage in E‐waste Recovery Systems

Sabbaghi

Cade²,

Olson

et al. 2018

J of Industrial Ecology

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“…In addition, the effects of vibration loadings on the solder joints of electronic packages were well studied. [15][16][17][18][19] For example, Jang et al 20 investigated the fatigue behavior of dummy solder balls in a solidstate drive under random vibration using a globallocal analysis technique. It was found that the corner of the controller package was the weakest component and, consequently, locating the solder balls on the corner led to an increase in the fatigue life of system.…”

Section: Introductionmentioning

confidence: 99%

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Ghaderi

Pourmahdavi

Samavatian

et al. 2018

Proceedings of the IMechE

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In this work, the combination of vibration loading and thermal cycle effects on the fatigue properties of a solder joint in a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) discrete was investigated. The fatigue mechanism under each loading mode was individually analyzed, and then according to the incremental damage superposition approach, the simultaneous effects were thoroughly studied. Under thermal cycling, the creep behavior of the solder is linked to the fatigue life. In fact, the creep accumulated strain in each thermal cycle has a straight relation to the failure time of solder joint. The origin of stress/strain in the assembly is owing to the sharp difference between coefficients of thermal expansions of the components in the electronic package. Regarding the vibration loading, the root mean square of peeling stress as a widely acceptable failure indicator was used to evaluate the vibration effects on the fatigue life. It is determined that the maximum stress is concentrated at the corner of solder layer. This result was similar to the outcomes of thermal cycling. The results also indicated that the combination of thermal and mechanical loadings accelerates the failure of the solder joint of the power MOSFET. Furthermore, the experimental and simulation studies showed similar results and approved the crack initiation at the corner of solder layer.

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“…This type of arrangements makes several different mechanical behaviors with the different natural frequencies peaking in the different parts of circuit board. Accordingly, mechanical reliability and stability of the circuit boards have become an open issue which needs more investigation in this (Kang et al, 2015;Samavatian et al, 2018b;Jang et al, 2016). In reality, electronic devices have to withstand mechanical shocks and vibration loads of various input frequencies throughout their operational life.…”

Section: Introductionmentioning

confidence: 99%

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

Gao

Wang

Ding

et al. 2020

SSMT

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Fatigue life estimations of solid-state drives with dummy solder balls under vibration

Cited by 24 publications

References 13 publications

The Global Flow of Hard Disk Drives: Quantifying the Concept of Value Leakage in E‐waste Recovery Systems

The Global Flow of Hard Disk Drives: Quantifying the Concept of Value Leakage in E‐waste Recovery Systems

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

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