2012
DOI: 10.1002/smll.201200674
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Fatigue‐Free, Electrically Reliable Copper Electrode with Nanohole Array

Abstract: Design and fabrication of reliable electrodes is one of the most important challenges in flexible devices, which undergo repeated deformation. In conventional approaches, mechanical and electrical properties of continuous metal films degrade gradually because of the fatigue damage. The designed incorporation of nanoholes into Cu electrodes can enhance the reliability. In this study, the electrode shows extremely low electrical resistance change during bending fatigue because the nanoholes suppress crack initia… Show more

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Cited by 49 publications
(34 citation statements)
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References 31 publications
(37 reference statements)
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“…To examine the effect of Al 2 O 3 encapsulation on the mechanical reliability of a Ag nanowire electrode, a cyclic bending test was conducted using a bending fatigue tester. The bending fatigue tester is capable of applying a bending stress for more than 500,000 cycles while in situ monitoring the change in the sample resistance 28 33 . The imposed bending strain for the test was set at 2.5%, which corresponds to a bending radius of 2.5 mm for a given substrate thickness of 125 μm.…”
Section: Resultsmentioning
confidence: 99%
“…To examine the effect of Al 2 O 3 encapsulation on the mechanical reliability of a Ag nanowire electrode, a cyclic bending test was conducted using a bending fatigue tester. The bending fatigue tester is capable of applying a bending stress for more than 500,000 cycles while in situ monitoring the change in the sample resistance 28 33 . The imposed bending strain for the test was set at 2.5%, which corresponds to a bending radius of 2.5 mm for a given substrate thickness of 125 μm.…”
Section: Resultsmentioning
confidence: 99%
“…Because PI is a non‐conductive substance, Cu can be used as a stable conducting layer on the PI nano‐hairy structures. Our previous work demonstrated that the Cu layer deposited on the nano‐hairy PI exhibited very strong bending fatigue resistance compared with a conventional Cu thin film under the cyclic bending fatigue test, which simulated the characteristics in a bendable environment . Electrical resistance of the thin film Cu on the pristine PI increased over 300% after 500 000 cycles, whereas the electrical resistance of the nanostructured Cu on the nano‐hairy PI showed extremely small increase, only less than 10%, even though their initial resistances were very similar (4.17 and 5.78 Ω, respectively).…”
mentioning
confidence: 87%
“…It has also been shown that 85% of initial capacitance is retained after 800 bending cycles from MnO 2 / EVA/CNT paper with moderate curvature [29]. It remains unclear, however, whether these devices can survive repeated folding/unfolding, and sometime twisting, where the active materials could be detached or even destroyed at the interface if they are only deposited on the surface of paper [30].…”
Section: Introductionmentioning
confidence: 97%